Adhesive composition, adhesive sheet and method for producing semiconductor device
A composition and adhesive technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, adhesives, etc., can solve problems such as peeling of the bonding interface, package cracking, and high stress, and achieve the effect of high sealing reliability.
Active Publication Date: 2017-10-24
LINTEC CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Therefore, the stress generated inside the semiconductor package during packaging becomes larger than before, and there is a high possibility of problems such as peeling of the adhesive interface or cracking of the package.
Method used
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Embodiment
[0119] Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. In addition, in the following examples and comparative examples, and were performed as follows.
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Abstract
The present invention provides an adhesive composition capable of bonding with sufficient adhesive strength, particularly high sealing reliability in a semiconductor device; an adhesive sheet having an adhesive layer composed of the adhesive composition; and A method of manufacturing a semiconductor device using the adhesive sheet. The adhesive composition of the present invention is characterized by comprising: an acrylic monomer polymerized by a living radical polymerization method using an organotellurium-containing compound as a polymerization initiator and having a weight average molecular weight (Mw) of 350,000 or more. Acrylic polymer (A), epoxy thermosetting resin (B) and thermosetting agent (C).
Description
technical field [0001] The present invention relates to an adhesive composition, an adhesive sheet having an adhesive layer composed of the adhesive composition, and a method for manufacturing a semiconductor device using the adhesive sheet. The adhesive composition is particularly Suitable for the process of die bonding semiconductor elements (semiconductor chips) to organic substrates or lead frames, as well as dicing silicon wafers, etc., and die bonding semiconductor chips to organic substrates. Substrate or lead frame process. Background technique [0002] Semiconductor wafers such as silicon and gallium arsenide are produced in a state of large diameter, and the wafer is diced into small element pieces (semiconductor chips), and then moved to the mounting process which is the next process. At this time, after the steps of dicing, washing, drying, expanding, and picking are applied in the state where the semiconductor wafer is attached to the adhesive sheet in advance,...
Claims
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IPC IPC(8): C09J133/04C09J7/00C09J7/02C09J11/06C09J163/00C09J175/04H01L21/301C09J7/22C09J7/30
CPCC09J163/00C09J175/04H01L21/6836H01L24/83H01L2221/68327H01L2221/68336H01L2221/6834H01L2221/68377C08F220/20C09J133/066H01L24/29H01L2224/2919C08G18/8022C08G2170/40C08L33/06C09J7/22C09J7/30C09J2203/326C09J2433/00C09J2463/00C09J7/20H01L21/78H01L2924/35121C09J7/385H01L21/187C09J133/00
Inventor 土山佐也香市川功
Owner LINTEC CORP