Integrated circuit high-precision positioning apparatus
A positioning device and integrated circuit technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve chip surface scratches, chip mounting positioning accuracy cannot meet technical requirements, and chip mounting glue is turned over to the upper surface of the chip, etc. problems, to achieve the effect of improving the positioning accuracy of film loading, realizing high-precision control, and improving displacement stability
Active Publication Date: 2016-03-02
BEIJING MXTRONICS CORP +1
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Problems solved by technology
Since the adjustment of positioning accuracy is done manually, during the operation, there will be unqualified situations such as causing damage to the surface of the chip, turning the mounting glue to the upper surface of the chip, etc.
[0004] With the continuous improvement of the level of packaging technology, the requirements for the positioning accuracy of epoxy resin chips are becoming more and more stringent, and the manually adjusted positioning accuracy of chips can no longer meet the technical requirements.
Method used
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[0026] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:
[0027] Such as figure 1 Shown is a schematic diagram of the composition of an integrated circuit high-precision positioning device. It can be seen from the figure that it includes a displacement display device 10, a positioning mold and a stage 8; the displacement display device 10 is fixedly installed on one end of the stage 8, and the positioning mold is fixed on the carrier. The upper end of the object table 8; wherein the positioning mold includes a beam base 1, a guide rod 2, a beam 3, a needle base 4, a needle holder 5, a needle holder 6, a rotary rod 7, a screw fine-tuning table 9 and a needle holder guide rod 11; 2 pieces The beam base 1 is symmetrically and fixedly placed on the stage 8, and the two guide rods 2 are fixedly connected with the beam base 1 axially and vertically, the beam 3 is vertically fixed on the upper part of the gui...
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The invention discloses an integrated circuit high-precision positioning apparatus, and belongs to the field of an integrated circuit package technology. The integrated circuit high-precision positioning apparatus comprises a positioning mold, a high-precision objective table, a displacement display apparatus and a chassis. The positioning mold comprises crossbeam bases, guide rods, a crossbeam, a needle base, needle stands, needles, a rotary rod, a spiral fine tuning bench and a needle stand guide rod. The displacement display apparatus is fixedly installed at the rear end of the chassis, the high-precision objective table is fixedly installed at the upper end of the chassis, and the positioning mold is fixedly installed at the upper end of the high-precision objective table. According to the invention, the high-precision objective table and the positioning mold are combined together to form an epoxy resin mounting high-precision positioning system, through the system, the epoxy resin mounting positioning precision is adjusted, and the scope of the epoxy resin mounting positioning precision can reach within + / -10[mu]m.
Description
technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a high-precision positioning device for integrated circuits. Background technique [0002] Epoxy resin mounting process is an important process in the integrated circuit packaging process. It is the process of fixing the integrated circuit chip on the ceramic substrate or shell through epoxy resin mounting adhesive. The epoxy resin loading process is mainly completed by semi-automatic equipment, and the positioning accuracy of the loading is usually adjusted manually with a microscope before curing. [0003] The positioning accuracy of the manually adjusted film loading is achieved by pushing the chip to the required position under the microscope with tweezers or dial needles. The positioning accuracy of the manually adjusted film loading can only reach ± 200 μm. Since the adjustment of the positioning accuracy is done manually, during the operation, there ...
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IPC IPC(8): H01L21/67
CPCH01L21/67H01L21/67011H01L21/67121
Inventor 荆林晓冯达陈宪荣冯小成贺晋春王娟
Owner BEIJING MXTRONICS CORP