Method for monitoring scrapped inner layer of printed circuit board multilayer board

Abstract

The invention relates to a method for monitoring a discarded inner layer of a multilayer board of a printed circuit board, and the method is characterized in that the method comprise the following steps: (1) making a square marking region at a broken edge of an inner core board where a printed circuit is made; (2) painting a white paint mark in the marking region when the inner core board is defective and discarded, and marking the printed circuit of the discarded inner core board through employing a conductive pen; (3) enabling the inner core board and a semi-solidified sheet serving as a dielectric layer material to be pressed together through a pressing machine; (4) carrying out the subsequent production of the printed circuit through employing the common technology, and windowing copper foil in the marking region during the making of an external circuit, so as to enable the marking region to be exposed. According to the invention, the mark is made at the broken edge of the printed circuit board, so the printed circuit board is small in size, and occupies a small space. The method can make corresponding adjustment according to the types, sizes and layer numbers of different printed circuit boards, thereby bringing convenience to a printed circuit board factory for production management, improving the equipment productivity and work efficiency, and reduces the unnecessary operation.

Description

technical field [0001] The invention relates to a method for monitoring scrapped inner layers of printed circuit board multilayer boards, in particular to a method for monitoring printed circuit boards using multiple inner layer core boards. Background technique [0002] With the development trend of thinner, thinner, integrated and multi-functional consumer electronic products, the requirements for the production process of printed circuit rigid-flex boards are getting higher and higher. Following this trend, printed circuit boards with multi-layer inner core board applications will gradually become an important part of printed circuit boards. Printed circuit boards with multi-layer inner core boards, as the name implies, are printed circuit boards with the number of inner core boards > 2 layers, and the number of inner core boards of ordinary printed circuit boards is ≤ 2 layers, which can make the thickness of the printed circuit board Thinner, more layers, faster sig...

AI Technical Summary

Problems solved by technology

[0003] At present, when the inner core circuit and the sub-outer circuit of the multi-layer printed circuit board are defectively scrapped in the production process, the general process uses a conductive pen to coat the circuit of the scrapped board, and forms a short circuit during the electrical test of the finished product. The paint pen draws lines on the edge of the veneer. After the finished product is scooped out, the bad board can be distinguished, which has double insurance. The above method has the following defects: the line is marked on the edge of the board, and it is difficult to see it from the appearance after it is scooped into a small board. Defects, especially circuit boards printed with black ink, for this kind of defective boards that cannot be distinguished in appearance, there is a short circuit through the electrical test of the machine, which will increase the workload of the machine and reduce the equipment utilization rate (production output). Because it is not sure whether it is a real short circuit or a short circuit of the previously reported bad board, it brings trouble to abnormal analysis

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