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Precise Positioning Mechanism for Green Porcelain Processing

A technology for precise positioning and green ceramic sheets, applied in stone processing equipment, work accessories, manufacturing tools, etc., can solve the problem of inaccurate positioning of green ceramic sheets, and achieve the effect of simple structure, novel design and accurate positioning

Active Publication Date: 2017-07-14
CHINA ELECTRONIC TECH GRP CORP NO 2 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a precise positioning mechanism for green ceramic sheet processing, which solves the existing technical problem of inaccurate positioning during green ceramic sheet processing

Method used

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  • Precise Positioning Mechanism for Green Porcelain Processing

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Embodiment Construction

[0009] The present invention is described in detail below in conjunction with accompanying drawing:

[0010] A precise positioning mechanism for green ceramic sheet processing, comprising a rectangular base 1, a column 2 is arranged at the right rear top corner of the rectangular base 1, a pin support seat 3 is provided on the top surface of the column 2, and a pin support seat 3 3 is provided with a pin shaft 4, an inclined cylinder hinge seat 7 is provided on the rectangular base 1 on the left front side of the column 2, and a fulcrum end hinge seat 6 is provided at the right rear top corner of the lower bottom surface of the rectangular raw ceramic sucker 5, A swing end hinge seat 11 is arranged at the left front top corner of the bottom surface of the rectangular green ceramic sheet sucker 5, and the bottom end of the cylinder body of the inclined cylinder 8 is hinged on the hinge seat 7 of the inclined cylinder. The top of the extension shaft 10 of the inclined cylinder 8 ...

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Abstract

The invention discloses an accurate positioning mechanism for green ceramic chip processing and aims at solving the problem of inaccurate positioning during green ceramic chip processing at present. The accurate positioning mechanism for green ceramic chip processing comprises a supporting-point end hinge seat (6) is arranged at a rear right vertex angle of a bottom surface of a rectangular green ceramic chip sucker (5), while an oscillating end hinge seat (11) is arranged at a front left vertex angle of the bottom surface of the rectangular green ceramic chip sucker; a top end of a projecting shaft (10) of a tilting cylinder (8) is hinged to the oscillating end hinge seat; the supporting-point end hinge seat (6) is hinged to a pin shaft (4); a front-and-back direction positioning cylinder (14) is arranged on a front side end of the bottom surface of the rectangular green ceramic chip sucker and a front-and-back direction positioning block (15) is arranged on a projecting shaft of the front-and-back direction positioning cylinder; a left-and-right direction positioning cylinder (12) is arranged on a left side end of the bottom surface of the rectangular green ceramic chip sucker and a left-and-right direction positioning block (13) is arranged on a projecting shaft of the left-and-right direction positioning cylinder. The accurate positioning mechanism for green ceramic chip processing is simple in structure, novel in design and accurate in positioning.

Description

technical field [0001] The invention relates to a positioning mechanism, in particular to a precise positioning mechanism for green ceramic sheet processing. Background technique [0002] Low-temperature co-fired ceramic production technology is to make low-temperature co-fired ceramic powder into green ceramic tape, slice it into shape, and perform punching, hole grouting, conductor, resistance printing and other processes on the formed green tape to produce the required circuit pattern. , and multiple passive components can be embedded in it, then multi-layer laminated together, sintered at 900 ° C to make a passive integrated component of a three-dimensional circuit network, or a three-dimensional circuit substrate with built-in passive components, IC and active devices can be mounted on its surface to make passive / active integrated functional modules. During the production process of punching, lamination and lamination of green ceramic sheets, it is necessary to accurat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/04
CPCB28D7/043B28D7/046
Inventor 王海珍张志耀杨卫田芳吕琴红白璐
Owner CHINA ELECTRONIC TECH GRP CORP NO 2 RES INST