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Thermally conductive composition having improved melt viscosity and molded article prepared from thermally conductive composition

A melt viscosity and composition technology, applied in the field of thermally conductive compositions, can solve problems such as tensile strain and impact strength deterioration, small molecule migration, etc.

Inactive Publication Date: 2016-03-30
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the functional groups in these molecules can additionally lead to degradation of the polyester or polyamide, resulting in poorer mechanical properties such as tensile strain and impact strength
Also, another problem is that these small molecules migrate to the surface of polyester or polyamide

Method used

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  • Thermally conductive composition having improved melt viscosity and molded article prepared from thermally conductive composition
  • Thermally conductive composition having improved melt viscosity and molded article prepared from thermally conductive composition
  • Thermally conductive composition having improved melt viscosity and molded article prepared from thermally conductive composition

Examples

Experimental program
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Embodiment

[0115] The abbreviation "E" means "Example", "CE" means "Comparative Example", and the numbers thereafter indicate in which example or comparative example the thermally conductive composition was prepared. All examples and comparative examples were prepared and tested in a similar manner. Percentages are by weight unless otherwise indicated.

[0116] Table 1 lists the components used in Examples and Comparative Examples.

[0117] Table 1

[0118]

[0119]

[0120] The compounding method of embodiment 1-11 and comparative example 1-5

[0121] Pellets of polyester and polyamide, and alumina were dried in a forced air-circulating oven at 80° C. for about 48 hours prior to compounding. Crush the sucrose ester into powder for use. According to the amount of each component in Table 2-4, polymer pellets and sucrose ester were firstly dry-blended. The resulting mixture was fed into the main feeder of a twin-screw extruder (EUROLAB 16 with a length-to-diameter ratio of 40:...

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Abstract

The present invention discloses a thermally conductive composition having improved melt viscosity and a molded article prepared from the thermally conductive composition. The thermally conductive composition comprises (a) about 29% to about 79% by weight of polyester or polyamide; (b) about 20% to about 70% by weight of alumina; (c) about 1 wt% to about 7% by weight of sucrose ester of formula 1 and (d) 0 wt% to about 15% by weight of an additive; wherein the wt% being based on the total weight of the thermally conductive composition.

Description

technical field [0001] The present invention relates to heat-conducting compositions with improved melt viscosity and moldings produced from said heat-conducting compositions. Background technique [0002] As an engineering polymer with excellent performance, thermoplastic polymer has outstanding dimensional stability, solvent resistance, high temperature resistance, impact resistance and excellent electrical insulation, so it is widely used in electrical equipment, electronic equipment, energy storage areas such as equipment, packaging and construction. In view of the high integration of microelectronics and the miniaturization of devices, the requirements for the thermal conductivity of the components and housings of laptop computers, TV sets, LED lights, instrument panels, etc. made of thermoplastic polymers are gradually increasing. For example, in order to prevent the entry of water vapor and dust, most of the electronic components are densely packed in a closed space,...

Claims

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Application Information

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IPC IPC(8): C08L67/02C08L77/00C08L77/06C08L77/02C08K3/22C08K5/1545C09K5/14
Inventor 戴炜枫潘霄王怡臻
Owner EI DU PONT DE NEMOURS & CO