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Cassette positioning device and semiconductor processing device

A technology for positioning devices and cassettes, applied in semiconductor/solid-state device manufacturing, transportation and packaging, conveyor objects, etc., can solve the problems of reducing transmission and process efficiency, wafer 6 offset, falling, etc., to improve transmission and Process efficiency, avoiding wafer position shifting or falling, and ensuring the effect of normal wafer pickup

Active Publication Date: 2016-03-30
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Because in the process of carrying the film cassette 1, the film cassette 1 will inevitably tilt and vibrate, which makes the wafer 6 easily shift outwards from the opening of the cassette 1, or even fall, thereby causing the manipulator to deviate due to the position of the wafer 6. Moved or dropped and cannot take the film normally, thus reducing the subsequent transmission and process efficiency

Method used

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  • Cassette positioning device and semiconductor processing device
  • Cassette positioning device and semiconductor processing device
  • Cassette positioning device and semiconductor processing device

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Embodiment Construction

[0031] In order for those skilled in the art to better understand the technical solution of the present invention, the cassette positioning device and semiconductor processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] Please also refer to Figure 3A-Figure 5C , the sheet box is composed of a top plate 21, a bottom plate 22, a side frame 23 and a rear pillar 24. One side has an open frame structure with an opening (located on the side opposite to the rear pillar 24), and the inner surfaces of these parts are correspondingly provided with along the The multi-layer notches arranged at intervals in the vertical direction are used to support the wafer.

[0033] The cassette positioning device includes a limit door 31, a positioning mechanism and an unlocking mechanism. Wherein, there are two limit doors 31 , which are respectively rotatably connected to the two side frames 23 . By rotating...

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Abstract

The invention provides a cassette positioning device and a semiconductor processing device. The cassette positioning device includes: a limiting door which is rotatably connected to a side frame of a cassette and can be located in a first position or a second position, wherein the first position and the second position can stop or cannot stop movement of wafers in the cassette; a positioning mechanism for locking the limiting door when the limiting door rotates to the first position; and an unlocking mechanism for releasing locking of the positioning mechanism on the limiting door when the wafers are needed to be released. The cassette positioning device can stop movement of the wafers relative to the cassette, so that position offset or falling of the wafers can be avoided, and a manipulator can normally take the wafers.

Description

technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a chip box positioning device and semiconductor processing equipment. Background technique [0002] Removing wafers from cassettes is the first step in the automatic transfer process of many semiconductor processing equipment, so the efficiency and reliability of wafer removal has become one of the important prerequisites for highly automated wafer production. [0003] figure 1 Schematic block diagram of semiconductor processing equipment. Such as figure 1 As shown, the semiconductor processing equipment includes a loading chamber 13 , a transfer chamber 2 and a reaction chamber 3 . Wherein, the loading chamber 13 is used to carry the cassette 1 with a plurality of wafers placed therein; a manipulator 4 is arranged in the transfer chamber 2 for taking out or putting in the wafer 6 from the cassette 1 in the loading chamber 13, And moving the wafer 6 into or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/687H01L21/677H01L21/67
Inventor 贾强余志龙李冬冬
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD