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An integrated package structure that reduces the space occupied by off-chip capacitors

A space-occupied, integrated packaging technology, applied in the electronic field, can solve the problems of multi-printed circuit board space, occupation, and increase the cost of chip application, and achieve the effect of simplifying the design

Active Publication Date: 2018-12-21
SPREADTRUM COMM (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In chip applications, the capacitors in the peripheral circuits often occupy too much space on the printed circuit board and increase the application cost of the chip, and setting the capacitors in the peripheral circuits on the chip will also sacrifice too much chip area. There is not yet an ideal way to lay out capacitors

Method used

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  • An integrated package structure that reduces the space occupied by off-chip capacitors
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  • An integrated package structure that reduces the space occupied by off-chip capacitors

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0018] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0019] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0020] refer to figure 1 , figure 2 , image 3 , an integrated packaging structure that reduces the spa...

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Abstract

The invention relates to the field of electronic technology, particularly to a package structure. An integrated package structure to reduce the footprint of an off-chip capacitor comprises a package for packaging a chip. Bonding pads for external connection are disposed on the package, capacitor units are connected onto the bonding pads at predetermined positions, and metal pad blocks are connected onto the bonding pads at other positions. According to the invention, the capacitor units are connected onto the bonding pads at the predetermined positions on the chip to replace capacitors in an external circuit, without an increase in the process complexity of the package structure, the peripheral circuit is simplified, convenience is brought to a customer in practical application and the requirements of low power consumption and high integration are met.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a packaging structure. Background technique [0002] Integrated circuit packaging not only plays the role of electrical connection between the bonding point of the integrated circuit chip and the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated circuit chip, so that the integrated circuit The chip can perform normal functions, and its high stability and reliability are guaranteed. In chip applications, the capacitors in the peripheral circuits often occupy too much space on the printed circuit board and increase the application cost of the chip, and setting the capacitors in the peripheral circuits on the chip will also sacrifice too much chip area. There is no one ideal way to lay out capacitors. Contents of the invention [0003] The object ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/64
Inventor 樊茂朱小荣
Owner SPREADTRUM COMM (SHANGHAI) CO LTD