Method for controlling stress damage in assembly process of printed circuit board

Abstract

The invention discloses a method for controlling stress damage in an assembly process of a printed circuit board. The method comprises the following steps: carrying out hollowing-out treatment on a corresponding position on a process edge corresponding to the local position which requires reducing mechanical stress damage on the printed circuit board, wherein the corresponding position serves as a slot hollowing-out region; and carrying out segmenting treatment on the process edge and the printed circuit board by a V-CUT cutter. In a plate segmenting step in the assembly process of the printed circuit board, segmenting treatment is carried out on the process edge and the printed circuit board by the V-CUT cutter. The slot hollowing-out region is separated from the printed circuit board, the V-CUT cutter does not directly act on the printed circuit board in the slot hollowing-out region; the local position corresponding to the slot hollowing-out region on the printed circuit board does not bear the plate-segmenting mechanical stress, so that an intact hole wall of a component hole close to the plate edge is protected; the component with poor mechanical stress resistance is prevented from being damaged; reliable connection of a solder joint is protected; and no burr at the local position with precise appearance requirements is ensured.

Description

technical field [0001] The invention relates to the field of printed circuit board design and assembly processing, in particular to a method for controlling stress damage during the printed circuit board assembly process. Background technique [0002] With the continuous development of science and technology, electronic and communication products are becoming more and more integrated and more powerful, but their volume is getting smaller and smaller, resulting in smaller and higher density printed circuit boards. Especially the devices and traces are getting closer and closer to the edge of the board. In order to meet the requirements of the production line, it is necessary to make a board design or add a process edge, and it is necessary to divide the printed circuit board or remove the process edge during the assembly process after the device is mounted. , so the requirements for manufacturability are getting higher and higher. [0003] Most of the manufacturability probl...

AI Technical Summary

Problems solved by technology

[0005] The second is the widespread use of spherical matrix array devices: spherical matrix array devices have many advantages over ordinary surface mount devices, such as higher sealing, lower thermal resistance and better electrical characteristics, but compared to ordinary surface mount devices with longer wires Mounted devices, under the same tensile and compressive strength, spherical matrix array devices cannot effectively disperse the pressure, and are more likely to cause solder joints to crack or internal damage

[0006] The third is the wide use of ceramic capacitors: due to the brittleness of its own medium, its ability to resist bending is very poor. Any operation that may cause bending and deformation of the printed circuit board during the production process will directly withstand various pressures from the printed circuit board. A mechanical stress, which leads to capacitor cracking failure

V-CUT knife is the simplest in printed circuit board processing and printed circuit board splitting operation, so it is widely used on printed circuit boards, but in the process of printed circuit board splitting, V-CUT knife produces The mechanical stress of the sub-board is about 600ustrain, which will cause damage to the printed circuit board and components on the printed circuit board

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