Magnetic fixture and FPC non-reinforced support electronic assembly welding process applying magnetic fixture

Abstract

The invention discloses a magnetic fixture and an FPC non-reinforce support electronic assembly welding process applying the magnetic fixture. The magnetic fixture comprises an installation platform and a positioning base. A first positioning hole is disposed in the positioning base. A magnetic steel sheet, an FPC non-reinforced support electronic assembly and a magnetic base plate are sequentially placed on the top of the positioning base from top to bottom. A first positioning pin is disposed at the bottom of the magnetic base plate, and the first positioning pin extends into the first positioning hole. According to the magnetic fixture and the process, the positioning base, the magnetic base plate and a spring PIN upper cover plate are positioned by using the first positioning pin, a second positioning pin, and the first positioning hole. The spring PIN upper cove plate can pressurize an FPC welding spot section to make an FPC welding surface smooth and prevent phenomena of a bad air welding float height and a negative offset. A pressurizing apparatus can control a pressure magnitude of the spring PIN upper cover plate to prevent damage to FPC, so as to improve welding quality of a solder joint and production efficiency, and reduce production cost.

Description

technical field [0001] The invention relates to a magnetic jig and a welding process for FPC unreinforced supporting electronic components using the same. Background technique [0002] Usually, the welding process of FPC (flexible circuit board) electronic components without reinforcement and support is completed by means of the traditional method of bottom cover plate or the cover plate made of synthetic stone material after secondary reflow soldering. This method has the following defects : [0003] 1. Using the traditional welding process, it is easy to cause abnormal function of the product after welding, that is, failure to conduct and short circuit; [0004] 2. Poor floating height of empty soldering, because most customers require that there is no need to add add-ons before welding the flexible circuit board, which will lead to uneven bottom of the welding components during welding, resulting in batch empty soldering and poor floating height; [0005] 3. Poor offset...

AI Technical Summary

Problems solved by technology

[0003] 1. Using the traditional welding process, it is easy to cause abnormal function of the product after welding, that is, failure to conduct and short circuit;

[0004] 2. Poor floating height of empty soldering, because most customers require that there is no need to add add-ons before welding the flexible circuit board, which will lead to uneven bottom of the welding components during welding, resulting in batch empty soldering and poor floating height;

[0005] 3. Poor offset: Because some large parts do not have positioning PIN (locating pin) positioning, direct welding will inevitably lead to a large number of empty welding defects. poor offset;

[0006] 4. Component damage: Using the carrier to directly contact the component to pressurize the production will inevitably increase the risk of bad damage to the component body

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