Laser cutting method for PCB containing copper layer

Abstract

The invention is applied to the field of laser machining, and provides a laser cutting method for a PCB containing a copper layer. The laser cutting method comprises the steps that different positions of the PCB are attracted, and the PCB is fixed to a working table; laser with first parameters is adopted to cut through the PCB along the cutting trajectory, and positions of all parts of the cut PCB and the positions of all parts of the PCB obtained before cutting keep unchangeable; and laser with second parameters penetrates a cutting gap to clean a cutting section. The position of the PCB obtained before cutting and the position of the PCB obtained after cutting keep unchangeable, the laser is utilized for cleaning the cutting section, and due to the fact that the PCB is not taken away, the laser cleans the cutting section along the edge of the cutting gap, and the laser can completely penetrate the surface of the lower end of the PCB from the upper end of the PCB, so that cleaning is convenient, and the cleaning effect is good; and the position of the PCB obtained before cutting and the position of the PCB obtained after cutting keep unchangeable, and it is ensured that during cleaning, the proper position can be accurately cleaned.

Description

technical field [0001] The invention belongs to the field of laser processing, in particular to a laser cutting method for a PCB board containing a copper layer. Background technique [0002] With the development of laser processing technology, in many fields, especially in the field of electronics and semiconductors, laser cutting technology has gradually replaced traditional mechanical cutting technology. In the PCB board cutting industry, the traditional cutting machine method is mainly the mechanical CNC cutting method. However, the mechanical cutting method has the following defects. 1. The PCB board directly contacts the high-speed rotating tool, and relies on high-strength mechanical force to destroy the material, which will cause damage to the PCB board. A certain force is generated on the PCB, which can easily lead to damage to the circuit or components in the board; 2. The mechanical cutting tool can only cut straight lines, and cannot meet the cutting of curves or...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the embodiments of the present invention is to provide a laser cutting method for a PCB board containing a copper layer, so as to solve the existing problems of unclean cutting section, residual copper powder, and leakage or short circuit of the PCB board

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