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Multifunctional smart card and method of making the same

A production method and smart card technology, applied in the field of smart cards, can solve the problems of complex production process, poor product reliability and high production cost, and achieve the effects of simple process, high reliability and simple structure

Active Publication Date: 2018-06-12
SHENZHEN AOXINGAO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this packaging method has many disadvantages: such as complex production process, high production cost, poor product reliability, thick overall thickness of smart card, low production efficiency, etc.

Method used

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  • Multifunctional smart card and method of making the same
  • Multifunctional smart card and method of making the same
  • Multifunctional smart card and method of making the same

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Embodiment Construction

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0034] In addition, it should also be noted that the directional terms such as left, right, upper, and lower in the embodiments of the present invention are only relative concepts to each other or refer to the normal use state...

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Abstract

Provided are a multi-functional smart card and a manufacturing method therefor. The multi-functional smart card comprises a substrate (1), a battery (2), a functional component (3) and a sealing film (4). An accommodating groove (11) and a sinking groove (114) surrounding the accommodating groove (11) are provided in one side of the substrate (1). The battery (2) and the functional component (3) are electrically connected to each other and are accommodated in the accommodating groove (11), and gaps between the two and the accommodating groove (11) are filled with glue. The sealing film (4) is accommodated in the sinking groove (114) and seals the battery (2) and the functional component (3). The manufacturing method for the multi-functional smart card comprises the following steps: S100, injection moulding the substrate (1) and forming the accommodating groove (11) and the sinking groove (114); S200, welding the battery (2) and the functional component (3); S300, placing the battery (2) and the functional component (3) into the accommodating groove (11); S400, filling gaps between the battery (2) and the functional component (3) and the accommodating groove (11) with glue; and S500, adhering the sealing film (4) to the sinking groove (114) to seal the battery (2) and the functional component (3) in the accommodating groove (11). The multi-functional smart card is simple in structure, high in reliability and extremely thin, and the manufacturing method therefor achieves the effect of an extremely thin smart card, and is simple and efficient in process and low in cost.

Description

technical field [0001] The present invention relates to the technical field of smart cards, in particular to a multifunctional smart card and a manufacturing method thereof. Background technique [0002] With the continuous advancement of integrated circuit packaging technology, the integration level of integrated circuits is increasing, the functions are becoming more and more abundant, and the requirements for product application fields are becoming more and more stringent, which requires integrated circuit packaging companies to develop new types of Package form to meet new requirements. In the field of smart card packaging, the domestic and foreign markets have a very large demand for smart cards. At present, the smart card industry is developing towards a technological innovation route. New technologies are emerging, and new manufacturing technologies are also increasing. Many old manufacturing technologies It is also continuously improved and strengthened, so it is in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/02
CPCG06K19/07G06K19/077
Inventor 吴志勇
Owner SHENZHEN AOXINGAO TECH CO LTD
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