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Test circuit board, its production method, test method and test system

A technology for testing circuits and circuit boards, which is applied in the direction of electronic circuit testing, measuring electronics, measuring devices, etc., can solve the problem of low measurement accuracy of via-hole signals, and achieve the effect of improving signal measurement accuracy

Active Publication Date: 2019-07-02
NEW FOUNDER HLDG DEV LLC +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect of low measurement accuracy of via signal in the prior art

Method used

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  • Test circuit board, its production method, test method and test system
  • Test circuit board, its production method, test method and test system
  • Test circuit board, its production method, test method and test system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The test circuit board provided by this embodiment, such as figure 1 shown, including:

[0042] Circuit substrate 1, one or multiple bonded, including a base material and a metal circuit layer disposed on both surfaces of the base material;

[0043] Metallized via holes 2 are provided through each of the circuit substrates 1;

[0044] The test signal leads 3 are arranged on any surface of any one of the base materials, one end thereof is electrically connected to the metallized via hole 2 , and the other end thereof is electrically connected to a test point on the surface of the test circuit board.

[0045] When using the signal testing device to test the above-mentioned test circuit board, it is possible to realize the measurement of the signal between the metallized via hole 2 and the test signal lead 3, and between the two ends of the test signal lead 3, and through methods such as calibration The signal measurement value is analyzed and optimized, so as to obtain th...

Embodiment 2

[0058] This embodiment provides a method for manufacturing a test circuit board, comprising the following steps:

[0059] Make a double-sided substrate or a multilayer circuit substrate 1, the double-sided substrate includes a base material and metal layers disposed on both surfaces of the base material, the multilayer circuit substrate 1 is composed of at least two etched double-sided substrates Bonding is formed, and only the metal layer of the inner layer in the multilayer circuit substrate 1 is etched into an internal metal circuit layer;

[0060] Drilling through holes on the double-sided substrate or the multilayer circuit substrate 1 and plating metal in the through holes to obtain metallized via holes 2;

[0061] Etching the metal layer on the outer layer of the double-sided substrate or the multilayer circuit substrate 1 to form an outer metal circuit layer;

[0062] Wherein, in the step of forming the inner metal circuit layer or the outer metal circuit layer, the c...

Embodiment 3

[0069] This embodiment provides a test method, using a signal test device to test the metallized via hole 2 in the test circuit board provided by the embodiment of the present invention, the test method includes the following steps:

[0070] The test result calibration of the test signal lead 3 in the test circuit board is reset to zero by using the signal test device;

[0071] The signal test device is used to measure the signal between the metallized via hole 2 and the test signal lead 3 , and the measurement result is used as the signal value of the metallized via hole 2 .

[0072] It should be noted that, in the step of using the signal test device to calibrate and reset the test result of the test signal lead 3 in the test circuit board to zero, place the two test terminals of the signal test device at a and c independently, to figure 2 The test result of the test signal lead 3 on the left side of the center is calibrated and reset to zero, and the two test terminals of...

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Abstract

The invention provides a test circuit board, a manufacturing method thereof, a test method and a test system. The test circuit board comprises one or multiple circuit substrates, metalized through holes and test signal leads, wherein the circuit substrates are bonded, and each circuit substrate comprises a base material and metal line layers arranged at the two surfaces of the base material respectively; the metalized through holes penetrate the circuit substrate; and each test signal lead is arranged at any a surface of any base material, one end of the test signal lead is electrically connected with the metalized through hole, and the other end of the test signal lead is electrically connected with a test point at the surface of the test circuit board. When a signal tester is used to test the test circuit board, signals between the metalized through hole and the test signal lead as well as signals between the test signal leads can be measured, the signal measurement values are analyzed and optimized in methods as calibration, and thus, signals values of the metalized through holes are obtained, and the signal measuring precision of the metalized through holes is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board testing, in particular to a testing circuit board, its manufacturing method, testing method and testing system. Background technique [0002] With the increase of PCB board density, signal integrity has become one of the issues that PCB design must pay attention to. The so-called signal integrity refers to the quality of the signal on the transmission path, and factors such as the parameters of the PCB, the layout of components on the PCB, and the wiring of high-speed signals will cause loss of the signal on the transmission path, resulting in poor system operation. Stablize. Therefore, it has become a hot topic in today's PCB design industry to test the signal loss of the PCB board to fully consider the factors affecting the signal integrity during the design process of the PCB board and take effective control measures. [0003] In PCB loss testing, via loss is a crucial part. The so-cal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2818
Inventor 刘丰
Owner NEW FOUNDER HLDG DEV LLC
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