An exposure method, an exposure device, and a color filter substrate
An exposure method and technology for color filter substrates, which are used in photolithography process exposure devices, microlithography exposure equipment, optics, etc., can solve the problems of long exposure tact and low alignment accuracy.
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[0046] Use the first alignment mark and the second alignment mark to drill holes on the black matrix layer above the base substrate by using the laser to form the pattern of the through hole corresponding to the first alignment mark, and the pattern of the through hole corresponding to the second alignment mark. The graphic of the penetration hole corresponding to the bit mark.
[0047] During specific implementation, the Figure 5 and Figure 6 As an example, the mask is placed above the black matrix, and the laser is used to drill holes on the black matrix layer above the base substrate by using the first alignment mark and the second alignment mark to form four through holes. Graphics; where the two through-holes on the same side are formed using the first alignment mark, and the other two through-holes are formed using the second alignment mark.
[0048] In specific implementation, in the above exposure method provided by the embodiment of the present invention, in step S3...
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