Unlock instant, AI-driven research and patent intelligence for your innovation.

Radiating device and manufacturing method thereof

A technology of a heat dissipation device and a manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of cumbersome manufacturing and assembly process, complex overall structure of the heat dissipation device, etc., and achieve the effect of simple structure and easy assembly.

Inactive Publication Date: 2016-04-27
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the overall structure of the heat sink is complicated, and the manufacturing and assembly process is relatively cumbersome.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radiating device and manufacturing method thereof
  • Radiating device and manufacturing method thereof
  • Radiating device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0033] Figure 1 to Figure 3 A heat sink 100 according to a first embodiment of the present invention is shown. The heat dissipation device 100 includes a heat dissipation substrate 10 and a heat dissipation fan 20 disposed on the heat dissipation substrate 10 . The heat dissipation substrate 10 includes an electronic component 350 ( Figure 8 ) of the first surface 101 and the second surface 102 opposite to the first surface 101 . The cooling fan 20 includes a bearing 21 and a rotor 22 pivotally connected to the bearing 21 . The bearing 21 is fixed on the second surface 102 of the heat dissipation substrate 10 .

[0034] The heat dissipation substrate 10 can be made of copper, aluminum, copper-aluminum composite material and other materials with good heat dissipation. The heat dissipation substrate 10 is a flat board, therefore, the first surface 101 and the second surface 102 are both flat surfaces. In this embodiment, the first surface 101 may be in direct contact with...

no. 2 example

[0043] See Figure 4 to Figure 6 , different from the first embodiment, in this embodiment, a through hole 110 is formed in the middle of the heat dissipation substrate 10 of the heat dissipation device 200 . A heat dissipation pad 113 is further disposed on the position where the first surface 102 of the heat dissipation substrate 10 faces the through hole 110 . The size of the heat dissipation pad 113 is larger than the opening size of the through hole 110 . In this embodiment, the heat dissipation pad 113 is a rectangular heat dissipation fin.

[0044] See Figure 7, when installed, the rotor 22 is pivotally connected in the bearing 21 , and the free end 210 of the bearing 21 away from the rotor 22 passes through the through hole 110 . The end surface of the free end 210 of the bearing 21 abuts against the upper surface of the heat dissipation pad 113 and is flush with the second surface 102 of the heat dissipation substrate 10 . The end surface of the free end 210 of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A radiating device comprises a radiating substrate and a radiating fan arranged on the radiating substrate, wherein the radiating substrate comprises a first surface used for adhering an electronic element and a second surface opposite to the first surface, the radiating fan comprises a bearing and a rotor pivoted to the bearing, and the bearing is fixed on the second surface of the radiating substrate. The invention further relates to a manufacturing method of the radiating device.

Description

technical field [0001] The invention relates to a cooling device and a manufacturing method thereof. Background technique [0002] Existing heat dissipation devices that can be used in electronic devices (such as mini hosts) generally include a heat sink and a heat dissipation fan matched with the heat sink. The radiator includes a first surface attached to the electronic components and a second surface opposite to the first surface. The heat sink includes a plurality of heat dissipation fins extending outward from the second surface. The heat dissipation fan is fixed on the heat dissipation fins by hooks or screws to quickly dissipate the heat conducted from the electronic components to the heat dissipation fins. However, the overall structure of the heat dissipation device is complicated, and the manufacturing and assembling process is cumbersome. Contents of the invention [0003] In view of this, it is necessary to provide a heat sink with simple structure and easy ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 林郁钦洪锐彣
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD