AgCuTi active brazing filler metal and preparation method thereof

Abstract

The invention discloses AgCuTi active brazing filler metal and a preparation method thereof. The AgCuTi active brazing filler metal is composed of, by mass, 60%-75% of Ag, 20%-35% of Cu and 1%-7% of Ti. In order to improve the dispersal uniformity of powder, main adopted measures are that AgCu28 powder, Cu powder and Ti powder of which the grain sizes are uniform (between 10 [mu]m and 30 [mu]m) are selected to be subjected to high energy ball milling (mechanical alloying) under the protection of Ar atmosphere. By means of a hot isostatic pressing process, the plastic processing performance is improved through a similar core-shell structure formed by atomic diffusion while the compactness of alloy ingots is improved. The defect of the simplex form of the AgCuTi active brazing filler metal in China is overcome, the problem that components of a single metal powder mixing method and a vacuum induction melting method are nonuniform is solved, and the competitiveness of Chinese active silver brazing filler metal in domestic and overseas markets is improved. Processing equipment required by the preparation method is simple and easy to operate, and large-batch preparation of active brazing filler metal alloy can be achieved quite easily.

Description

technical field [0001] The invention relates to AgCuTi active solder and a preparation method thereof. Background technique [0002] AgCuTi active solder has properties such as suitable solid / liquidus temperature, excellent wettability and high brazing joint strength, and is mainly used for brazing between ceramics and ceramics, metal and ceramics, and carbon materials, such as al 2 o 3 with CaF 2 、Al 2 o 3 With Cu, SiC and TC4 and Cu-C composite metal and Al 2 o 3 connection between. According to the existing literature and related reports, Ti-containing active solder has become the research focus and hot direction of ceramic joining, but the technical bottleneck that has plagued the popularization and application of AgCuTi active solder is its low processing and forming performance. [0003] The main reason for the poor processing and forming performance of AgCuTi active solder is that Ti is easy to react with most metals to form brittle intermetallic compounds, wh...

AI Technical Summary

Problems solved by technology

The main disadvantages are: the need for extremely high vacuum (-3 Pa); limited to the intensity of intermediate frequency induction, it is difficult to obtain an ingot with uniform composition; due to the high activity of Ti, it is easy to react with the commonly used crucible, while affecting the quality of the alloy ingot, it is also dif

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