Wafer back thinning method
A backside thinning and wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as silicon material waste
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[0028] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.
[0029] The invention proposes a method for thinning the back of the wafer. After removing the damaged layer on the back of the wafer, the silicon on the back of the wafer is peeled off layer by layer by using hydrogen ion implantation and high-temperature annealing process, thereby realizing wafer back thinning. At the same time, the stripped silicon thin layer can be further utilized, such as making solar cells.
[0030] figure 1 A flow chart of a wafer backside thinning method according to a preferred embodiment of the present invention is schematically shown.
[0031] Such as figure 1 As shown, the wafer backside thinning method according to a preferred embodiment of the present invention includes:
[0032] The first step S1: provide the w...
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