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Mechanical type material-taking mechanism

A reclaiming mechanism and mechanical technology, applied in the field of machinery, can solve the problems of poor adsorption force, small size of semiconductor wafers and high cost, and achieve the effects of low power consumption and ingenious structure

Active Publication Date: 2016-05-04
SUZHOU GUANGYUE MICRO NANO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] First, due to the small size of the semiconductor material, the vacuum adsorption method is used, which has poor adsorption force and is easy to drop
[0004] Second, high cost and power consumption

Method used

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  • Mechanical type material-taking mechanism
  • Mechanical type material-taking mechanism
  • Mechanical type material-taking mechanism

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Experimental program
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Embodiment Construction

[0030] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0031] In order to achieve the purpose of the present invention, in some embodiments of the mechanical retrieving mechanism,

[0032] The mechanical retrieving mechanism includes: a base 1 , a driving device 2 , a pressing plate 3 , a material claw 4 and a material claw fixing block 5 . In this embodiment, the driving device 2 adopts an air cylinder.

[0033] The upper end surface of the pressing plate 3 is connected with the output shaft of the air cylinder, and the air cylinder drives the pressing plate 3 up and down. The two opposite ends of the pressing plate 3 are connected with the material claw 4 through the tension spring 6 in transmission connection. The material jaws 4 are arranged in pairs on opposite ends of the pressing plate 3, and each material jaw 4 includes a connecting portion 41 connected to the tension spring 6 and a gra...

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PUM

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Abstract

The invention discloses a mechanical type material-taking mechanism. The mechanical type material-taking mechanism comprises a base, a driving apparatus, a pressing plate, material claws and material claw fixing blocks, wherein the pressing plate is in transmission connection with the driving apparatus; the driving apparatus is used for driving the pressing plate to lift; one end or opposite two ends of the pressing plate and the material claws are in transmission connection through tension springs; each material claw comprises a connection part connected with the corresponding tension spring, and a grabbing part used for grabbing material pieces; the material claw fixing blocks are fixedly arranged on the base; the material claw connecting parts and the material claw fixing blocks are rotationally connected through connecting shafts; the driving apparatus drives the pressing plate to lift, and the pressing plate drives the grabbing parts of the material claws to do circular motion by taking the connecting shafts as the center of a circle. The mechanical type material-taking mechanism is simple in structure, low in cost and low in power consumption; and meanwhile, a phenomenon of material dropping off in the material piece transfer process can be avoided, so that the production material of the material pieces is improved.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to a mechanical retrieving mechanism. Background technique [0002] In the front-end process of semiconductor blank production, it is often necessary to use a retrieving mechanism to take the blank from one station to the next. The traditional retrieving mechanism uses vacuum adsorption to take the material, but there are several problems. [0003] First, due to the small size of the semiconductor material, the vacuum adsorption method is adopted, and its adsorption force is poor, and it is easy to drop the material. [0004] Second, the cost is high and power consumption is high. [0005] Therefore, a mechanical retrieving mechanism with simple structure, low cost, low power consumption, and not easy to drop materials needs to be proposed urgently. Contents of the invention [0006] In order to solve the above technical problems, the present invention proposes a mechanical...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/687
CPCH01L21/67706H01L21/68707
Inventor 刘晓成史晓华
Owner SUZHOU GUANGYUE MICRO NANO TECH CO LTD