Suspended force-sensitive sensor chip capable of eliminating encapsulation stress and manufacture method thereof

Abstract

The invention relates to a suspended force-sensitive sensor chip capable of eliminating encapsulation stress and a manufacture method thereof. The chip comprises a monocrystalline silicon substrate, and a cantilever beam and a pressure sensor which are both integrated on the monocrystalline silicon substrate, wherein the cantilever beam and the pressure sensor are integrated on the same surface of the monocrystalline silicon substrate by a monocrystalline silicon substrate single-side microprocessing method, the pressure sensor is integrated on the structure of the cantilever beam, and a reference pressure cavity is directly embedded in the cantilever beam. The dynamic properties of a freedom of movement structure at the tail end of the cantilever beam are fully utilized by the suspended force-sensitive sensor chip, the adverse effect of the outer encapsulation stress of the chip on the detection performance of the force-sensitive sensor can be effectively inhibited by the pressure sensor on the cantilever beam, the friendly encapsulation of encapsulation base plates of different materials is realized by the force-sensitive sensor, and the detection stability of the sensor and encapsulation environment adapting reliability are improved. The suspended force-sensitive sensor chip has the advantages of novel design, simple structure, low encapsulation cost, small chip size and low chip cost. The requirement of massive production is met.

Description

technical field [0001] The invention belongs to the technical field of silicon micromechanical sensors. It relates to a force-sensitive sensor chip and a manufacturing method thereof, in particular to a suspension-type force-sensitive sensor chip and a manufacturing method thereof that eliminate packaging stress, which can effectively suppress the adverse effects of packaging stress on the detection performance of a force-sensitive sensor, and is especially suitable for Friendly encapsulation of different material encapsulation substrates. Background technique [0002] In recent years, with the rapid development of micro-electromechanical systems (MEMS) technology, silicon-based pressure sensors, as one of the traditional mechanical detection devices of MEMS sensors, have been widely used in aerospace, biochemical medicine, life sciences, automotive electronics and other fields. For example, the detection accuracy, linearity, and repeatability of pressure sensors in force-s...

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is to provide a floating force-sensitive sensor chip and a manufacturing method that eliminates packaging stress, which is used to solve the problem of packaging substrates of different materials in different physical environments during the application process of the existing force-sensitive sensor chip The packaging stress generated by the deformation in the environment has a negative impact on the detection performance of the force-sensitive sensor, thereby realizing the low-cost, high-efficiency, friendly and convenient packaging of the force-sensitive pressure sensor chip with different material packaging substrates

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