Impregnation forming method for capacitor core assembly

An impregnation molding and capacitor technology, applied in capacitors, capacitor manufacturing, circuits, etc., can solve the problems of difficult infiltration of core groups, time-consuming and energy-consuming, high liquid viscosity, etc., to achieve stable feeding speed, strong process versatility, The effect of surface tension reduction
CN101121159BActive Publication Date: 2010-12-01CHENGDU HONGMING ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
CHENGDU HONGMING ELECTRONICS CO LTD
Publication Date
2010-12-01

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Abstract

The present invention relates to a novel dip forming method of a specific dry-type capacitor. An isolation screen is added. A core group, which dips the dipping material from bottom to upside, is adopted, and a glass rod is used in a diversion step. The core group is thoroughly solidified by the heat preservation of a multi-temperature zone. The purpose of the present invention is to solve the problems of dipping and an encapsulation of the specific capacitors and the relevant electronic equipments. With a strong technical generality, less implementation difficulty, little investment and stable and reliable quality, the dip forming can satisfy the requirements of the electronic equipment of miniaturization, dry-type (solidification), large span of working temperature-zones and strong environmental applicability. The present invention can be used for manufacturing specific capacitors which are applied to high current with high temperature and high voltage, such as a filter capacitor which is used for high-voltage electrical source of airplane, an engine-igniting capacitor, a deep-well pulse sound wave exploration etc. The present invention can also be used in the encapsulation field of high-performance electronic equipment.
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Description

A kind of impregnation forming method of capacitor core group technical field The invention relates to a dipping and encapsulation molding method for electronic equipment, in particular to a dipping molding method for a capacitor core group. Background technique The impregnation molding process of special high-voltage pulse capacitors is generally packaged in a metal case or a plastic case, and then impregnated with oil. At present, there are two commonly used methods, one of which is the commonly used wet impregnation process, which generally adopts perfusion and soaking methods, the equipment and operation are complex, time-consuming, energy-consuming, and costly; the other is the conventional dry impregnation molding process. , can only achieve the purpose of perfusion, the exhaust is not thorough, it is very difficult for the impregnating material to infiltrate the inside of the capacitor core group, and the performance and reliability of the product cannot be improved...

Claims

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