Preparation method and packaging method of a metal airgel-based solder preform

A solder preform and airgel-based technology, applied in airgel preparation, metal processing equipment, welding equipment, etc., can solve problems such as insufficient strength, difficult coating, holes, etc., and achieve stable welding quality and low cost , The effect of simple preparation process

Active Publication Date: 2022-04-22
HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN (INSTITUTE OF SCIENCE AND TECHNOLOGY INNOVATION HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN)
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing nano-silver solder paste is difficult to meet the packaging requirements of this type of structure. Not only is it difficult to apply, but also due to the volatilization of components such as flux and surfactant, it is easy to cause reliability problems such as holes and insufficient strength, and even virtual soldering, fail

Method used

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  • Preparation method and packaging method of a metal airgel-based solder preform
  • Preparation method and packaging method of a metal airgel-based solder preform
  • Preparation method and packaging method of a metal airgel-based solder preform

Examples

Experimental program
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Effect test

Embodiment 1

[0045] A silver nanowire airgel-based solder preform and packaging method thereof, the specific method comprising:

[0046] (1) Use lignin and amino acid hydrolysis monomers to prepare three-dimensional growth active agents, and mix them with metal precursors (AgNO 3 ), surfactant (PVP), oxidizing agent (FeCl 3 ), etc., and stir evenly; put it into a closed reaction mold for heating, and react to obtain a silver nanowire airgel-based tissue containing a solvent inside, and use a sodium chloride solution (1M) to clean the obtained silver nanowire gel tissue to remove its The remaining reaction reagents and free nanowire monomers in the interior are dried again, and the surface is cut with a low-voltage electron beam to remove the uneven area, and a silver nanowire aerogel with a thickness of about 5 mm is obtained; the obtained silver nanowire aerogel The schematic diagram of the structure of the glue is shown in figure 1 shown.

[0047] (2) Hot-press the obtained clean silv...

Embodiment 2

[0051] An application of a method for encapsulating a nano-copper wire airgel-based solder preform doped with nano-silver, the specific method comprising:

[0052] (1) Using silver nitrate as a precursor, PVP as a surfactant, ferric chloride as an oxidant, and ethylene glycol as a solvent, nano-silver particles were prepared by liquid phase reduction method, with an average particle size of 30-50 nm; The obtained nano-silver particles were repeatedly washed with ionized water and alcohol, and dried at 50°C to obtain clean nano-silver particles;

[0053] (2) Using copper sulfate pentahydrate as the precursor, sodium hypophosphite monohydrate as the reducing agent, diethylene glycol as the solvent, and PVP as the surface active agent as the reducing agent, copper nanowires were prepared by the liquid phase reduction method, using Repeated washing and centrifugation of the obtained copper nanowires with ethanol and deionized water solution to remove residual reagents; and using a...

Embodiment 3

[0060] A silver nanowire airgel preform and packaging method for depositing a Sn coating on the surface, the specific method comprising:

[0061] (1) The silver nanowire aerogel was prepared by liquid-phase induced reduction reaction and supercritical drying, and the obtained silver nanowire gel was washed with sodium chloride solution (1M), and the silver nanowire aerogel was aerosolized by electroless plating method. A Sn coating of about 20 nm was deposited on the surface of the gel, and a low-power laser was used for cutting to obtain a silver nanowire aerogel with a thickness of about 50 mm containing the Sn coating.

[0062] (2) The obtained silver nanowire airgel matrix with Sn coating was hot-pressed at low temperature, and then cut into preformed sheets with an average thickness of 50 μm, the hot-pressing temperature was 100 ℃, and the hot-pressing time was 10 min .

[0063] (3) Place the obtained silver nanowire airgel containing Sn coating between ceramic materials...

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Abstract

The invention provides a method for preparing an aerogel-based solder preform and a method for encapsulating it. The method for preparing an aerogel-based solder preform comprises the following steps: preparing an aerogel matrix, and performing Cleaning and cutting the surface; compressing the obtained metal airgel matrix, and cutting to obtain the solder preform. When using airgel-based solder preforms for packaging, process them according to the soldering structure to adapt the size and shape; then place the processed metal airgel-based solder preforms at the position to be soldered and align , pressurize, and apply a welding load to complete the package. The nano metal airgel-based material obtained by the technical solution of the present invention has good variability performance, structural adaptability and material compatibility; does not contain additional flux and protective agent, etc., and requires low welding temperature and high solder joint integrity , Post-weld strength and high-temperature performance are good, which can solve the problems of large-size low-temperature packaging and high-temperature service of heterogeneous materials.

Description

technical field [0001] The invention relates to the field of electronic packaging materials and technologies, in particular to a method for preparing and packaging a metal airgel-based solder preform. Background technique [0002] With the continuous innovation of the electronics industry and the development of the third-generation wide-bandgap semiconductors silicon carbide (SiC) and gallium nitride (GaN), the integration and power density of electronic systems are increasing day by day, with high temperature (> 250 ℃) service requirements Power electronic devices have been more and more widely used. However, traditional packaging materials and technologies are difficult to meet the packaging and service requirements of such devices. Common Sn-based solders have a low melting point, and will directly lose structural strength and stability at high temperatures; high-lead solders have serious environmental toxicity; the cost of An-Sn high-temperature solder alloys is extr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/02B23K35/40B01J13/00
CPCB23K35/02B23K35/40B01J13/0091
Inventor 祝温泊杨帆韩喆浩胡少伟胡博李明雨
Owner HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN (INSTITUTE OF SCIENCE AND TECHNOLOGY INNOVATION HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN)
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