Modular embedded integrated circuit socket
An integrated circuit and embedded technology, applied in the direction of circuits, electrical components, fixed/insulated contact components, etc., can solve the problems of poor product compatibility and high mold cost, and achieve the effect of compact structure, high solution cost and reliable contact
Inactive Publication Date: 2016-05-04
中国电子科技集团公司第四十研究所
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Problems solved by technology
[0003] The mounting plate, cover plate and contacts of the existing integrated circuit socket are all designed according to the structure and size of the integrated circuit package, and each package needs to be designed with an integrated circuit socket, that is, each chip of the integrated circuit socket requires Specially customize a kind of integrated circuit socket, the mold cost is high, and the product compatibility is poor
Method used
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Embodiment Construction
[0018] Embodiments of the present invention are described in detail below in conjunction with the accompanying drawings:
[0019] The modular embedded integrated circuit socket includes a mechanical drive assembly and a contact assembly. The mechanical drive assembly is composed of a cover plate 2 and a base 5, such as figure 1 with figure 2 As shown, the middle part of the cover plate 2 is provided with cooling holes 23, the bottom surface of the cover plate 2 also has several heat dissipation grooves 24, the left side of the cover plate 2 has two connecting blocks 21, the right side has two ear plates 22, and the left end of the base 5 There are two vertical bosses 51, and there is a hanging platform 52 at the bottom of the right side. The bosses 51 are located on both sides of the two connecting blocks 21, and the connecting shaft 1 passes through the connecting block 21 and the bosses 51. The connecting shaft 1 is covered with a first torsion spring 61, the first torsion...
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The invention relates to a modular embedded integrated circuit socket which comprises a mechanical driving assembly and a contact element assembly. The mechanical driving assembly consists of a cover board and a base; the cover board is hinged with the left side of the base; the right side of the base can be locked with a hanging station by a fixture block; a cavity for accommodating the contact element assembly is formed at the bottom of the base; a bump is formed on the inner wall of the cavity; the contact element assembly comprises a mounting plate, a contact element and a heat dissipation guide pillar; both the contact element and the heat dissipation guide pillar are mounted on the mounting plate; a groove is formed on the side wall of the mounting plate; and the groove is in interference fit with the bump so as to clamp the contact element assembly in the cavity. The integrated circuit socket disclosed by the invention is compact in structure and reliable in contact, has temperature resistance, and meanwhile, can be compatible to various integrated circuit packaging parts only by replacing contact element modules according to appearance of the integrated circuit packaging parts, so that development and production cost of the product is greatly reduced.
Description
technical field [0001] The invention relates to an electronic component, in particular to a modular embedded integrated circuit socket. Background technique [0002] Integrated circuits are the core of military microelectronics technology, and are widely used in various military equipment such as radars, computers, communication equipment, navigation equipment, fire control systems, and electronic countermeasure equipment. quantification and high reliability. In order to ensure the quality of integrated circuit devices, integrated circuit manufacturers must conduct burn-in tests for each integrated circuit packaged device they produce, so they must have many specifications of integrated circuit sockets that are compatible with the output and variety. [0003] The mounting plate, cover plate and contacts of the existing integrated circuit socket are all designed according to the structure and size of the integrated circuit package, and each package needs to be designed with ...
Claims
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IPC IPC(8): H01R13/514H01R13/40
CPCH01R13/514H01R13/40
Inventor 张洁肖颖刘明珠周庆平
Owner 中国电子科技集团公司第四十研究所