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Method for reinforcing and binding flexible circuit board and sensor and component for method

A flexible circuit board and sensor technology, applied in the touch screen field, can solve problems such as poor touch and easy detachment of the flexible circuit board, and achieve the effect of short curing time and firm binding

Inactive Publication Date: 2016-05-04
SHENZHEN ZHILING WEIYE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problems of easy detachment and poor touch of the flexible circuit board in the prior art, the present invention provides a method for reinforcing and binding the flexible circuit board and the sensor and its components

Method used

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Embodiment Construction

[0015] The present invention will be further described below using specific examples. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.

[0016] An embodiment of the present invention provides a method for reinforcing and binding a flexible circuit board and a sensor, including the following steps:

[0017] Step 1: Bind the flexible circuit board to the sensor;

[0018] Step 2: Add adhesive to the binding position of the flexible circuit board.

[0019] Specifically, the sensor is a glass sensor (referred to as G-sensor for short) or a film sensor (referred to as F-sensor for short). ACF is used to bind the FPC to the G-sensor or F-sensor. After the binding is completed, the FPC Add adhesive to the binding ...

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PUM

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Abstract

The invention provides a method for reinforcing and binding a flexible circuit board and a sensor and a component for the method. The method comprises the following steps: binding the flexible circuit board and the sensor, and supplementing an instantaneous curing adhesive at the binding position point of the flexible circuit board. The component comprises the flexible circuit board and the sensor which is bound to the flexible circuit board, wherein the adhesive is added to the binding position of the flexible circuit board and the sensor. The adhesive with an instantaneous curing effect is supplemented at the binding position point of the flexible circuit board, so that the tensile strength of the flexible circuit board is increased; the flexible circuit board is quickly stabilized after being bound; the functions are not affected after bending, inserting and extracting and stretching for plurality of times; and the production yield is greatly improved.

Description

[technical field] [0001] The invention relates to the field of touch screens, in particular to a method for reinforcing and binding a flexible circuit board (Flexible Printed Circuit, FPC) and a sensor and components thereof. [Background technique] [0002] With the development of science and technology, more and more electronic products have entered the era of intelligence, and the touch panel has become an important window for intelligent man-machine exchange. The conductive adhesive (English translation is anisotropic conductive adhesive film, referred to as ACF) is bonded together without any other stabilization measures. Because in the subsequent production process, the operator often touches the part of the flexible circuit board, and after multiple touches Under normal circumstances, the flexible circuit board is prone to problems such as detachment and poor touch. [0003] In order to fix the flexible circuit board and the sensor more firmly without adding additiona...

Claims

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Application Information

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IPC IPC(8): H05K3/30C09J163/00C09J161/06C09J123/06C09J11/06
CPCC08K2201/014C08L2205/03C09J11/06C09J163/00H05K3/305C08L61/06C08L23/06C08K5/07C08K5/521
Inventor 苏伟王雷
Owner SHENZHEN ZHILING WEIYE TECH
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