Laminated ceramic electronic component and method for manufacturing the same
A technology of electronic components and manufacturing methods, which is applied to parts of fixed capacitors, multilayer capacitors, electrodes of fixed capacitors, etc., can solve the problems of reduced humidity resistance reliability, and achieve the effect of improving humidity resistance reliability.
Inactive Publication Date: 2016-05-11
MURATA MFG CO LTD
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Embodiment Construction
[0085] Embodiments of the present invention are shown below, and the characteristic parts of the present invention will be described in more detail.
[0086] [Structure of Multilayer Ceramic Capacitor According to Embodiment]
[0087] figure 1 It is a perspective view showing the structure of a multilayer ceramic electronic component (three-terminal type multilayer ceramic capacitor) according to an embodiment of the present invention, figure 2 is a perspective view showing the structure of a ceramic body constituting the multilayer ceramic capacitor, image 3 It is a diagram showing a state when the multilayer ceramic capacitor according to the embodiment of the present invention is viewed from the first side surface.
[0088] This multilayer ceramic capacitor 50 includes a ceramic body 10 formed by laminating a plurality of ceramic layers 3. The ceramic body 10 has a first end face 1 and a second end face 2 that face each other, and a first end face 1 and a second end fac...
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Abstract
The present invention provides a laminated ceramic electronic component that prevents infiltration of water into a ceramic element assembly, has high moisture resistance reliability, and has high flexibility in capacitance designing; and a method for manufacturing the same. A side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces.
Description
[0001] This application is a divisional application of an invention patent application with an application date of July 25, 2013, an application number of 201310316449.4, and an invention title of "Laminated Ceramic Electronic Components and Manufacturing Method". technical field [0002] The present invention relates to a multilayer ceramic electronic component such as a multilayer ceramic capacitor and a method for manufacturing the same. Background technique [0003] One of typical multilayer ceramic electronic components is a multilayer ceramic capacitor. Furthermore, the multilayer ceramic capacitor includes strip-shaped external electrodes formed on the side surfaces of the ceramic body. [0004] For example, Patent Document 1 discloses a chip-shaped three-terminal capacitor having a structure including a pair of end surface external electrodes (for example, signal terminal electrodes) and strip-shaped side surface external electrodes on the outer surface of the capaci...
Claims
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IPC IPC(8): H01G4/232H01G4/30
CPCH01G4/232H01G4/30H01G4/12H01G4/005H01G4/228
Inventor 岛田泰之泽田隆司
Owner MURATA MFG CO LTD