Laminate type ceramic electronic component and manufacturing method therefor

Abstract

In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni-B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni-B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

Description

technical field [0001] The present invention relates to a laminated ceramic electronic component and its manufacturing method, in particular to a laminated ceramic electronic component including a plating film formed by direct plating on an external electrode in such a manner as to be electrically connected to a plurality of internal electrodes, and a manufacturing method thereof. Background technique [0002] Such as Figure 5 As shown, a multilayer ceramic electronic component 101 represented by a multilayer ceramic capacitor generally has a component body 105 of a laminated structure. The component body 105 includes, for example, a plurality of stacked ceramic layers 102 made of dielectric ceramics, A plurality of layered internal electrodes 103 and 104 are formed at the interface between the ceramic layers 102 . On one and the other end faces 106 and 107 of the component main body 105 , respective end portions of the plurality of internal electrodes 103 and the plurality...

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