Laminate type ceramic electronic component and manufacturing method therefor

Abstract

In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni-B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni-B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

Description

technical field [0001] The present invention relates to a laminated ceramic electronic component and its manufacturing method, in particular to a laminated ceramic electronic component including a plating film formed by direct plating on an external electrode in such a manner as to be electrically connected to a plurality of internal electrodes, and a manufacturing method thereof. Background technique [0002] Such as Figure 5 As shown, a multilayer ceramic electronic component 101 represented by a multilayer ceramic capacitor generally has a component body 105 of a laminated structure. The component body 105 includes, for example, a plurality of stacked ceramic layers 102 made of dielectric ceramics, A plurality of layered internal electrodes 103 and 104 are formed at the interface between the ceramic layers 102 . On one and the other end faces 106 and 107 of the component main body 105 , respective end portions of the plurality of internal electrodes 103 and the plurality...

AI Technical Summary

Problems solved by technology

At this time, if the coating film is soft, cracks are less likely to occur on the coating film, but due to the above-mentioned stress, the coating film will peel off and a gap will easily occur between the part body and the component body.

Therefore, moisture infiltrates into the gap, resulting in deterioration of insulation resistance, which may lower the reliability of multilayer ceramic electronic parts

On the other hand, if the plated film becomes hard, the fixing force increases, the plated film becomes brittle, and cracks occur on the plated film, thereby reducing the reliability of multilayer ceramic electronic components.

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