A printed circuit board and its manufacturing method

Abstract

A printed circuit board manufacturing method provided in the present invention comprises arranging a first copper plate on the upper surface of the inner layer, etching the first copper plate to make a circuit pattern, arranging a prepreg on the upper surface of the first copper plate, and arranging a prepreg on the upper surface of the prepreg. One layer of false core board, the second copper plate is arranged on the lower surface of the inner layer, the copper clad laminate is arranged on the lower surface of the second copper plate, the fourth copper plate is arranged on the lower surface of the copper clad laminate, and the inner layer is laminated, after lamination Drill holes in the non-circuit pattern area on the upper surface of the inner layer and carry out hole metallization by sinking copper, and make an annular ring for the drilled holes on the lower surface of the inner layer after lamination, and make an annular ring on the upper surface of the inner layer after lamination Controlled depth milling is carried out, and the laminated inner layer is packaged to obtain a printed circuit board, which avoids the secondary generation of annular rings on the graphics surface that does not need to be made by annular rings, and realizes the production of single-sided annular ring technology, and single-sided metallization The application of the manufacturing process of the annular ring saves the outer layer space and increases the wiring density of the circuit and the annular ring.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] Printed circuit board (English: Printed circuit board, abbreviation: PCB), with an insulating board as the base material, cut to a certain size, with at least one conductive pattern attached to it, and holes (such as component holes, fastening holes, Metallized holes, etc.), used to replace the chassis of the previous electronic components and realize the interconnection between electronic components. [0003] Metallized holes and rings are often involved in common printed circuit boards. The so-called metallized holes refer to a layer of thin copper plated on the inner wall of the hole with a chemical reaction on the hole wall between the top layer and the bottom layer, so that the printed circuit board The top layer and the bottom layer of the printed circuit board are connected to e...

AI Technical Summary

Problems solved by technology

[0003] Metallized holes and rings are often involved in common printed circuit boards. The so-called metallized holes refer to a layer of thin copper plated on the inner wall of the hole with a chemical reaction on the hole wall between the top layer and the bottom layer, so that the printed circuit board The top layer and the bottom layer of the printed circuit board are connected to each other, and the annular ring is used for welding the upper and lower surfaces of the user's printed circuit board with the components. When making the hole structure, it is generally necessary to cover the hole with a dry film to solve the problem of no metal in the hole. At present, the existing technology does not solve the problem of making single-sided eyelets

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