A device and method for detecting thermal migration performance of interconnection solder joints

Abstract

The invention discloses a device and a method for detecting the thermal migration performance of interconnected welding spots. The device sequentially comprises a cooling mechanism, an upper heat conduction plate, a lower heat conduction plate and a heating plate from top to bottom, namely, the cooling mechanism is arranged at the upper part of the upper heat conduction plate and the lower heat conduction plate is arranged at the upper part of the heating plate; and a sample is arranged in a space between the upper heat conduction plate and the lower heat conduction plate. A temperature control device of the heating plate is adjusted to obtain the temperature required by the heating plate; a rotating speed adjusting device of a cooling fan is adjusted to adjust the air volume of the fan so as to change the temperature of the hot and cold ends of the sample, and the required temperature gradient can be obtained according to the height of the welding spot. The device and the method have high safety reliability, the structure is simple and can be operated easily, the cost is low, popularization can be realized easily, electromigration interference can be effectively avoided, and the temperature gradient can be effectively controlled by control of the temperature difference of the cold and hot ends.

Description

Technical field [0001] The invention relates to the field of electronic packaging, in particular to a device and method for detecting the thermal migration performance of interconnection solder joints. Background technique [0002] With the development of electronic products in the direction of miniaturization and multi-function, the feature size of electronic packaging interconnect solder joints is getting smaller and smaller, resulting in a sharp increase in the current density experienced by the interconnect solder joint and the temperature gradient at both ends of the solder joint. The electromigration and thermal migration effects in the solder joint cause the deterioration of the solder joint structure and the damage of the structural integrity, which greatly reduces the reliability of the solder joint. [0003] For a long time, people have ignored the influence of thermal migration when studying electromigration. This may be because early research has always believed that th...

AI Technical Summary

Problems solved by technology

Although the study of electromigration has made great progress, the study of thermomigration is still in its infancy due to the difficulty of experimental design due to thermoelectric coupling.

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