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Die bonding platform and manufacturing method thereof

A manufacturing method and platform technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as difficulty in applying die-bonding platforms and insufficient rigidity, and achieve simple structure, high maintenance, and uniform heating Effect

Active Publication Date: 2018-05-04
SHINKAWA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the wafer heating device described in Patent Document 3 has the problem that even if the wafer placed on the surface can be uniformly heated, only the periphery thereof is supported because the ceramic plate is embedded in the cylindrical holding container. , therefore, the overall rigidity is insufficient, and it is difficult to apply to the structure of the die-bonding platform

Method used

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  • Die bonding platform and manufacturing method thereof
  • Die bonding platform and manufacturing method thereof
  • Die bonding platform and manufacturing method thereof

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Embodiment Construction

[0048] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 It is a schematic diagram showing the cross-section of the die bonding platform 100 of the present invention, and the size ratio of each component is changed for illustration. Such as figure 1 As shown, the die bonding platform 100 of the present embodiment includes: a metal rigid block 10 as a base; a metal flat plate 20 installed on the rigid block 10; a ceramic plate 30 as a surface plate overlapping the flat plate 20 Plate-shaped heater 40 is arranged on one side of the rigid body block 10 of the flat plate 20; a heater pressing plate 45 is arranged on the lower side (rigid body block 10 side) of the heater 40; and as an elastic body coil spring ( coil spring) 50 is disposed between the heater platen 45 and the rigid body block 10 .

[0049] Such as figure 2 As shown, the rigid block 10 is on the disk, as figure 1 , figure 2 As shown, a plurality of pr...

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Abstract

The invention provides a die bonding platform and a manufacturing method thereof. The die bonding platform includes: a rigid body block (10), on its surface (16), a plurality of protrusions (11) with a flat upper surface; a flat plate (20), fixed on a supporting surface (18) above the protrusions (11); The ceramic plate (30) is fixedly adsorbed on the flat plate (20); the plate heater (40) is configured on the rigid block (10) side of the flat plate (20); and the coil spring (50) is arranged on the heater ( 40) and the rigid body block (10), and make the heater (40) close to the surface of the rigid body block (10) side of the flat plate (20).

Description

technical field [0001] The invention relates to a structure of a bonding stage and a manufacturing method thereof. Background technique [0002] The flip chip bonding method is widely used. In this flip chip bonding method, after forming a film of solder on the tip of a pillar (pillar) on an electrode of a semiconductor chip (chip), the semiconductor chip is reversed, and the surface formed on the semiconductor chip (chip) is reversed. The film of solder at the tip of the pillar is heated against the electrodes of the substrate to melt the solder and mount the semiconductor chip on the substrate. A device that mounts a semiconductor chip on a substrate upside down in this way is called a flip chip bonder. [0003] The flip chip bonding method is to simultaneously connect multiple electrodes of the semiconductor chip to multiple electrodes on the substrate. Therefore, it is important to keep the substrate parallel to the semiconductor chip so that the solder formed at the fr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/75H01L21/67103H01L2224/75251H01L2224/75744H01L2224/75983
Inventor 和田庄司
Owner SHINKAWA CO LTD