Integrated circuit (IC) card high-speed distortion test device and method thereof

A testing device and bending testing technology, applied in the direction of using repetitive force/pulsation force to test the strength of materials, can solve the problems of large testing error, low testing efficiency, damage, etc., to achieve strong practicability and flexible testing solutions. Effect

Inactive Publication Date: 2016-06-01
AEROSPACE INFORMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The shortcoming of the IC card distortion test method in the above-mentioned prior art is: the test quantity of this test method is few, and test error is big, and test efficiency is low, and is destructive test, just can't become the product leaving the factory after the test.

Method used

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  • Integrated circuit (IC) card high-speed distortion test device and method thereof
  • Integrated circuit (IC) card high-speed distortion test device and method thereof
  • Integrated circuit (IC) card high-speed distortion test device and method thereof

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Embodiment 1

[0037] The problem to be solved by the present invention is to aim at the deficiencies of the existing IC card bending test methods, and provide a method that can realize online testing of IC cards in production and bending fatigue stress testing of IC cards with a large number of samples, and can also realize the bending fatigue stress test of small IC cards. A test plan for bending fatigue stress test of batch IC cards.

[0038] The working principle of the embodiment of the present invention is: a test device is composed of two rotating devices, and the two rotating devices are respectively a fixed wheel device and a moving wheel device. The structural representation of the IC card high-speed distortion testing device that the embodiment of the present invention provides is as follows figure 1 As shown, the device includes: four test devices, and a lifting device for lifting the height of the two test devices in the middle. The fixed wheel device in the test device is comp...

Embodiment 2

[0048] Based on the above figure 1 Shown IC card high-speed distortion testing device, the processing procedure of the IC card high-speed bending test method of the embodiment of the present invention comprises:

[0049] Embodiments of the present invention will figure 1 The four test devices from left to right in the figure are respectively called the first test device, the second test device, the third test device and the fourth test device. The rotation direction of the fixed wheel device and the moving wheel device is determined by the transmission direction of the IC card. The following two transmission directions of the IC card are used to illustrate:

[0050] 1: When the IC card is transmitted from left to right, the upper rotating device in the first test device is a fixed wheel device, which rotates counterclockwise, and the lower rotating device is a driving wheel device, which rotates clockwise , to the right to the angle calculated by Equation 1 above.

[0051] ...

Embodiment 3

[0060] Embodiment provides a kind of test method that IC card is sampled in large quantities and carries out bending test, see figure 1 . The method is basically the same as the second embodiment, except that there should be IC card transceiver boxes at both ends of the device. The first pass of the equipment operation is the same as the second embodiment, the IC card is moved from the left to the right, and then the first and third deflection motors return the first and third moving wheel devices to the initial position, the second and the third The third deflection motor deflects the moving wheel device to the left to the θ angle position, and all the transmission motors rotate in reverse, realizing the transmission of the IC card from right to left. By repeating N times like this, the bending experiment and test of IC card N×4 times is realized.

[0061] After the test stops, turn over the IC card in the card box and put it back into the card box to perform the test on th...

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PUM

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Abstract

The invention provides an IC card high-speed distortion test device and a method thereof. The device comprises four groups of IC card testing equipments and an elevating device, each group of the testing equipment is put by two rollers capable of performing bidirectional rotation, wherein one roller concentrically rotates by referring a center of the other roller, so that a bending deformation test of the IC card during a transmission process is realized by bending deformation of an external diameter of the roller. Two intermediate groups of testing equipments can be adjusted according to bending amount by an elevating motor or/and a hydraulic elevating device, and the transmission direction of the IC card returns to an original direction. IC card counter-current transmission is realized by changing the rotation direction of the rollers, a scheme of the invention realizes control of the bending deflection of the IC card by an deviation angle, bending tests with frequency of four times for each group or multiple times of number four are carried out, the double-face bending tests of the IC card can be simultaneously realized by two on-line groups of equipment, integration of a card reception/sending device is convenient, and the device and the method are adapted to batch automation detection and flexural fatigue test of the IC card.

Description

technical field [0001] The invention relates to the technical field of IC card (Integrated Circuit Card, integrated circuit card) testing, in particular to an IC card high-speed distortion testing device and method. Background technique [0002] IC cards are used more and more widely in our life, and the number of usage is increasing. However, in the process of use, it often happens that the IC card cannot continue to be used after a period of use. Analyze the IC card returned after damage, except for the artificially damaged IC card, most of them are due to the virtual connection between the chip, virtual welding or coil deformation, which causes the IC card to be unusable after a period of time. Phenomenon. [0003] At present, a kind of IC card distortion test method in the prior art is: put the IC card in two card slots, force the IC card to bend and deform by changing the distance between the two card slots, and bend the distance between the card slots of the testing e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/34
Inventor 王顺仁马振洲陈召安王璀夏栩刘鑫
Owner AEROSPACE INFORMATION
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