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A production and processing method of packaging substrate based on expansion and contraction process control

A packaging substrate and process control technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as deviation, low product quality, scrapping, etc., increase the pass rate of expansion and contraction, and reduce processing and production costs , the effect of reducing production costs

Active Publication Date: 2018-06-22
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is often a discrepancy between the actual expansion and contraction of the base material of the packaging substrate and the expansion and contraction obtained before the material is put into production. High, leading to a large part of the final packaged substrate products being scrapped due to low product quality

Method used

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  • A production and processing method of packaging substrate based on expansion and contraction process control
  • A production and processing method of packaging substrate based on expansion and contraction process control
  • A production and processing method of packaging substrate based on expansion and contraction process control

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Embodiment 1

[0032] Such as figure 1 As shown, the production and processing method of the packaging substrate based on expansion and contraction process control described in the embodiment of the present invention includes the following steps:

[0033] S101. Provide the packaging substrate to be processed, adjust the size of the CAM data according to the first expansion and contraction, make inner layer drilling holes on the packaging substrate according to the CAM data, and make several positioning targets or positioning on the packaging substrate hole;

[0034] Wherein, the first expansion and contraction is determined by the package substrate type, and after the first expansion and contraction is determined, the size of the CAM data can be correspondingly determined according to the first expansion and contraction. The CAM data includes drilling files and circuit graphics files, whose size is adjusted according to the expansion and contraction of the board. The purpose of adjusting th...

Embodiment 2

[0039] see figure 2 , the production and processing method of the packaging substrate based on the expansion and contraction process control described in the embodiment of the present invention includes the following steps:

[0040] S201. Provide the packaging substrate to be processed, adjust the size of the CAM data according to the first expansion and contraction, make inner layer drilling holes on the packaging substrate according to the CAM data, and make several positioning targets or positioning on the packaging substrate hole;

[0041] S202. Obtain the first actual expansion and contraction of the packaging substrate when the inner layer is exposed according to the plurality of positioning targets or the positioning holes, and determine whether the first actual expansion and contraction is within a first preset range;

[0042]Wherein, if the packaging substrate expands and shrinks uniformly during the exposure of the inner layer, the first preset range is defined acc...

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Abstract

The invention discloses an expansion and shrinkage process control-based production method for a package substrate. The method comprises the following steps: providing a to-be-processed package substrate, adjusting the size of CAM data according to first expansion and shrinkage, fabricating an inner-layer drill hole on the package substrate according to the CAM data and fabricating four positioning holes; obtaining actual expansion and shrinkage of the package substrate in the production process, judging whether the actual expansion and shrinkage are in a preset range or not, if so, further producing the package substrate; and if not, carrying out scrap processing on the package substrate. The expansion and shrinkage process control-based production method for the package substrate can timely carry out scrap processing on the package substrate of which the actual expansion and shrinkage are not in the preset range as an expansion and shrinkage exception product, and can prevent the expansion and shrinkage exception product from flowing into the subsequent procedure, so that the qualified rate of a package substrate product is improved; and the production cost is greatly reduced.

Description

technical field [0001] The invention relates to a production and processing method of a packaging substrate, in particular to a production and processing method of a packaging substrate based on expansion and contraction process control. Background technique [0002] After the packaging substrate is put into production, the size of the substrate is prone to expansion or contraction during the processing processes such as moisture absorption and heat. Therefore, before the production of circuit boards, it is necessary to determine the expansion and contraction of each base material of the packaging substrate. The expansion and contraction of the base material determines the CAM data of the package substrate, and then produces the package substrate according to the CAM data, and finally the circuit accuracy of the finished package substrate can meet the requirements. However, there is often a discrepancy between the actual expansion and contraction of the base material of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCH01L21/48
Inventor 卢汝烽李志东邱醒亚
Owner GUANGZHOU FASTPRINT CIRCUIT TECH