Electronic device with dustproof function and method for manufacturing electronic device

A technology of electronic devices and functions, which is applied in the field of manufacturing electronic devices with dustproof functions, and can solve problems such as damage to microphone chips

Inactive Publication Date: 2016-06-08
ELITE MICROPOWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Generally speaking, a conventional micro-electromechanical (MEMS) microphone device has a hole in the cover of the package structure to allow the microphone chip in the package structure to receive external sound signals through the hole. However, external dust will also pass through the hole. The hole enters the packaging structure of the MEMS microphone device and causes damage to the microphone chip in the packaging structure

Method used

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  • Electronic device with dustproof function and method for manufacturing electronic device
  • Electronic device with dustproof function and method for manufacturing electronic device
  • Electronic device with dustproof function and method for manufacturing electronic device

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Embodiment Construction

[0036] Please also refer to figure 1 as well as figure 2 , figure 1 What is shown is a simplified cross-sectional schematic diagram of an electronic device 100 with dustproof function according to a first embodiment of the present invention, figure 2 What is shown is a simplified top view of the electronic device 100 , where the electronic device 100 may be a micro-electro-mechanical (MEMS) microphone device. Such as figure 1 As shown, the electronic device 100 includes: a cavity structure 110, a first electronic component 120, a second electronic component 130 and a connection pad 140, wherein the cavity structure 110 can be a packaging structure, and the first electronic component 120 It may be a micro-electromechanical microphone element, and the second electronic component 130 may be an application specific chip (ASIC). The cavity structure 110 includes: a base 150 and a cap 160 , wherein the base 150 may be a printed circuit board (PCB), and the material of the cap ...

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Abstract

The invention discloses an electronic device with a dustproof function and a method for manufacturing the electronic device. The electronic device comprises a cavity structure and a first electronic element. The cavity structure comprises a substrate and a shell cover. The shell cover is connected to the substrate and is provided with a hole and a projection, wherein the projection projects toward the inside of the cavity structure; and the first electronic element is arranged in the cavity structure, wherein the first electronic element and the hole of the shell cover are blocked by the projection.

Description

technical field [0001] The present invention relates to an electronic device and a method for manufacturing the electronic device, in particular to an electronic device with dustproof function and a method for manufacturing the electronic device with dustproof function. Background technique [0002] Generally speaking, a conventional micro-electromechanical (MEMS) microphone device has a hole in the cover of the package structure to allow the microphone chip in the package structure to receive external sound signals through the hole. However, external dust will also pass through the hole. The hole enters the packaging structure of the MEMS microphone device and causes damage to the microphone chip in the packaging structure. Contents of the invention [0003] In view of this, one object of the present invention is to provide an electronic device with dustproof function and a method for manufacturing the electronic device with dustproof function, so as to solve the above-me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
Inventor 庄达昌
Owner ELITE MICROPOWER
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