Automatic trace erasing and adhesive-sealing process device capable of comprehensively increasing tin-plating first pass yield of LED

Abstract

The invention discloses an automatic trace erasing and adhesive-sealing process device capable of comprehensively increasing the tin-plating first pass yield of LED. The automatic trace erasing and adhesive-sealing process device comprises a support structure, a propulsion cylinder, a push rod, a support frame, a lifting cylinder, an L-shaped support plate, a quantitative solution conveying and erasing device, a solution conveying tube, a solution storage cylinder, a conveying pump and a controller, wherein the quantitative solution conveying and erasing device comprises a quantitative solution conveying support, at least two rotary shafts installed on the quantitative solution conveying support, and solution bonding wheels installed on each rotary shaft respectively, and a solution outlet end of the solution conveying tube is communicated to the solution bonding wheels and enables erasing solution to quantitatively permeate from the surfaces of the solution bonding wheels. According to the invention, a trace erasing mould-release agent for location of LED supports during an automatic charge process is realized, no adhesive attachment phenomenon of the LED supports is guaranteed, the working of manually spraying the mould-release agent by workers is omitted, the working efficiency is optimized, and the air quality of the field working is improved.

Description

technical field [0001] The invention relates to an LED smearing and sealing process device, in particular to an automatic trace smearing and sealing process device for comprehensively improving the tin pass-through rate on the LED. Background technique [0002] At present, the bracket pins of LampLED often have batch or sporadic pins in the LED sealing process. Due to the climbing phenomenon of epoxy resin in the baking environment, the pins near the bottom of the tube body are smeared. The phenomenon of liquid crawling, commonly known as the technical term "climbing glue", is generally not easy to find with the naked eye, and it needs to be clearly seen with a special microscope. If there is glue climbing phenomenon, the workload and cost to be dealt with are very high. What's even more frightening is that these glue-climbing LED products will flow to downstream customers, which will cause bad results in batch tinning. If there are hidden quality problems or safety acciden...

AI Technical Summary

Problems solved by technology

[0002] At present, the bracket pins of LampLED often have batch or sporadic pins in the LED sealing process. Due to the climbing phenomenon of epoxy resin in the baking environment, the pins near the bottom of the tube body are smeared. The phenomenon of liquid crawling, commonly known as the technical term "climbing glue", is generally not easy to find with the naked eye, and it needs to be clearly seen with a special microscope. If there is glue climbing phenomenon, the workload and cost to be dealt with are very high. What's even more frightening is that these LED products with creeping glue will flow to downstream customers, which will cause bad results in batch tinning

If there are hidden quality problems or safety accidents in electrical products, even if the bad tinning can be found, the cost of rework or replacement will be very high, and the loss will be very large

And the anti-climbing glue method of the prior art is to use spray release agent, the effect is not ideal and thorough enough, and it has a negative impact on the working environment of the staff

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