A kind of display and coating method of polyimide resin layer in display module

A technology of polyimide resin and polyimide resin, which is applied to the coating field of polyimide resin layer in displays and display modules, to improve competitiveness, improve product yield, and solve leveling bad sex effect

Active Publication Date: 2019-03-15
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The embodiment of the present invention provides a method for coating a polyimide resin layer in a display and its display module to solve the technical problem in the prior art that it is necessary to rely on adding a flat layer to ensure uniform coating of the PI film

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  • A kind of display and coating method of polyimide resin layer in display module
  • A kind of display and coating method of polyimide resin layer in display module
  • A kind of display and coating method of polyimide resin layer in display module

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Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] Since the substrate is designed with a lot of peripheral leads in the non-display area, or dummy R, G, B color resistance, or peripheral vias, etc., the film surface of the peripheral product is uneven. After PA (polyimide acid) is coated on it It is easy to cause uneven diffusion. The present invention is just to solve this problem.

[0025] see figure 1 , figure 1 It is a flow diagram of a preferred embodiment of the coating method of th...

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Abstract

The invention provides a display and a coating method for a polyimide resin layer in a display module of the display.The coating method comprises the steps that a non-display area of a substrate to be coated is coated with a polyimide acid material, and a display area of the substrate to be coated is coated with the polyimide acid material, wherein the leveling property of the polyimide acid material coated to the non-display area is superior to that of the polyimide acid material coated to the display area, and an overlaying layer is formed between the polyimide acid material coated to the non-display area and the polyimide acid material coated to the display area; high-temperature curing is conducted on the substrate coated with the polyimide acid material so that the continuous and integrated polyimide resin layer can be formed on the display area and the non-display area.According to the coating method for the polyimide resin layer in the display module, under the situation that a flat layer is not used, the method that before normally coating a display area PI layer, the edge area is coated with a circle of PI layer easily and effectively solves the problem that the leveling property of the PI on the edge is not good.

Description

technical field [0001] The invention relates to the technical field of display coating production, in particular to a method for coating a polyimide resin layer in a display and a display module thereof. Background technique [0002] The production of TFT display devices is very complicated. It needs to go through the fabrication of array substrates, color filter substrates, dripping of liquid crystals on the array substrates, coating frame glue on the color filter substrates, and the completion of the above processes of array substrates and color filter substrates. For the group, the whole production process of the TFT display device is completed through solid baking, cutting and other processes. There is a process in the production process: the process of coating PI (polyimide resin) on the array substrate and the color filter substrate, referred to as: PI process. At present, the commonly used PI printing methods are basically divided into two categories: letterpress pri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D1/26B05D3/02G02F1/1339
CPCB05D1/26B05D3/0254B05D2505/50G02F1/1339
Inventor 谢克成
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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