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Copper-deficiency automatic supplementing method with no need of repeatedly avoiding copper

An automatic and complementary technology, applied in the EDA field, can solve problems such as redundant workload, waste of manpower and material resources, and hinder the design speed of PCB boards, so as to avoid redundant workload and improve design speed.

Inactive Publication Date: 2016-06-15
INSPUR GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the design of PCB boards, it is currently necessary for designers to perform multi-step operations, resulting in a large amount of repetitive and redundant workload, wasting manpower and material resources, and seriously hindering the design speed of PCB boards.

Method used

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  • Copper-deficiency automatic supplementing method with no need of repeatedly avoiding copper

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Experimental program
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Embodiment 1

[0012] This embodiment describes a method for automatically filling copper deficiency without repeated copper avoidance. On the basis of cadence software, through the Skill program interface of Allegro software, the copper deficiency of copper foil (Shape) is automatically filled; mainly The steps include: 1) Set the attributes of the copper foil (Shape) hole, 2) Step by step detect each hole, determine whether there is a hole (via) in the hole, 3) Determine the shape of the copper foil to fill the hole And select it, and fill all the gaps without holes (via).

[0013] The copper deficiency described in this embodiment automatically fills up and does not need to repeat the method of avoiding copper. Through the Skill program interface of Allegro software, the written skill performs calculations, and each hole is detected step by step; if a hole is detected in the center of the hole ( If via) exists, the output is done; if no via is detected in the center of the hole, it means ...

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Abstract

The invention discloses a copper-deficiency automatic supplementing method with no need of repeatedly avoiding copper, and relates to the technical field of EDA. On the basis of cadence software, deficient copper of a Shape is automatically supplemented through a Skill program interface of Allegro software; the method comprises the main steps that 1, attribute setting is performed on deficient holes of the Shape; 2, each deficient hole is detected step by step, and whether a via exists in each deficient hole or not is determined; 3, the Shape with the deficient holes needing to be supplemented is determined and selected, and all the deficient holes with no via are supplemented. The method is beneficial to rapidly designing a PCB, redundant workloads brought by manual multistep operations in design are effectively avoided, and the designing speed of the PCB is increased.

Description

technical field [0001] The invention relates to the technical field of EDA, in particular to a method for automatically filling copper deficiency without repeating copper avoidance. Background technique [0002] With the development of society, people's requirements for electronic products are getting higher and higher. In order to cater to and satisfy the public's psychology, the electronic information industry is also conducting continuous research and practice, developing new electronic products, and promoting the development of the information age. . The upgrading of electronic products promotes the rapid development of the electronic industry. As the cornerstone of development, PCB board design requires continuous improvement and innovation. Cadence software has very rich and powerful functions, and it has good operability. It can edit its database, so as to realize some functions that the program does not provide, and improve the efficiency of layout work. However, i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/39G06F2119/18
Inventor 张得文刘金凤高新迪
Owner INSPUR GROUP CO LTD
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