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Single-lens device for automatically detecting two-dimensional morphology and temperature of water substrate

An automatic detection and single-lens technology, applied in the direction of measuring devices, instruments, etc., can solve the problem of high cost and achieve the effect of cost reduction

Active Publication Date: 2016-06-22
NANCHANG ANGKUN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the single-lens type automatic detection device for the two-dimensional shape and temperature of the wafer substrate provided by this embodiment needs to use two lenses for integrating the temperature measurement device through the second light splitting element 14, that is, it is arranged on the laser emitting device, and is used to turn the laser The emitted divergent light is refracted into the first lens 16 of the first parallel light beam, and the second lens 18 is arranged on the laser receiving device for refracting the second parallel light beam into converging light so as to be received by the laser receiving device. The cost of the single-lens type automatic detection device for the two-dimensional shape and temperature of the wafer substrate provided by the embodiment is relatively high

Method used

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  • Single-lens device for automatically detecting two-dimensional morphology and temperature of water substrate

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Embodiment 1

[0031] For ease of understanding, the attached image 3 The light path diagram of only one of the spots is given.

[0032] The single-lens type automatic detection device for the two-dimensional shape and temperature of the wafer base includes a single-lens type automatic detection device for the two-dimensional shape and temperature of the wafer base, a second light splitting element, and a device for detecting the temperature of the wafer base.

[0033] The single-lens type automatic detection device for the two-dimensional shape and temperature of the wafer substrate includes N PSDs, N beams of laser light and the first light splitting element. The N beams of laser light correspond one-to-one. The N beams of laser light are reflected by the first beam splitting element and then enter the second beam splitting element. After passing through the second beam splitting element, the incident light is formed. N incident points are formed, and the incident light is reflected by t...

Embodiment 2

[0063] See attached Figure 4 The difference between the single-lens type automatic detection device for the two-dimensional shape and temperature of the wafer substrate provided by the second embodiment of the present invention and the first embodiment of the present invention is that the N-beam laser is controlled by an attached Figure 5 The multi-channel laser emitting device shown emits. The multi-path laser emitting device used in the single-lens type automatic detection of the two-dimensional shape and temperature of the wafer substrate provided by the present invention includes a multi-path beam splitting prism 26 and a laser 25, and the multi-path beam splitting prism 26 includes a plurality of beam splitting surfaces, multiple Parallel between the two beam splitting surfaces, the included angle α between the multiple beam splitting surfaces and the horizontal direction is 45° respectively, the centers of the multiple beam splitting surfaces are on the same straight l...

Embodiment 3

[0069] The difference between the single-lens type automatic detection of the two-dimensional shape and temperature of the wafer substrate provided by the third embodiment of the present invention and the first and second embodiments of the present invention is that the single-lens automatic detection of the wafer substrate provided by the third embodiment of the present invention The two-dimensional shape and temperature device can also include a light-passing device, which is arranged on the optical path where the incident light and the first reflected light beam pass through together, and the light-passing device is provided with N light-passing holes, and N light-passing holes There is one-to-one correspondence between the holes and the N beams of laser light, and reflectors 11 are arranged at intervals in the light-passing holes, which are used to reverse the direction of the corresponding passing beam by 90°, so that the corresponding PSD can be turned to another direction...

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Abstract

The invention discloses a single-lens device for automatically detecting the two-dimensional morphology and temperature of a water substrate, and belongs to the technical field of semiconductor material nondestructive testing. According to the single-lens device for automatically detecting the two-dimensional morphology and temperature of a water substrate, a lens is arranged behind a beam-splitting plain film before light beams are transmitted to a wafer substrate, and the lens is arranged in front of the beam-splitting plain film after second-type reflected light beams are formed. Thus, only one lens instead of two lenses is needed, or, there is no need for a laser and a detector to be each integrated with a lens during selection of the laser and the detector. Therefore, the cost of the device for detecting the two-dimensional morphology of a water substrate is reduced.

Description

technical field [0001] The invention relates to the technical field of non-destructive testing of semiconductor materials, in particular to a single-lens-type device for automatically detecting the two-dimensional shape and temperature of a wafer substrate. Background technique [0002] See attached figure 2 , the invention patent application with the application number 201410188236.2 discloses a device for automatic real-time and rapid detection of the two-dimensional shape of the wafer substrate. To the second light-splitting element 14, the incident light is formed after passing through the second light-splitting element 14, and the incident light is incident on the wafer substrate, and forms N incident points along the radial direction on the wafer substrate, and the incident light forms N beams after being reflected by the substrate. One kind of reflected light beams, each of the first kind of reflected light beams passes through the second light splitting element 14 a...

Claims

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Application Information

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IPC IPC(8): G01D21/02
Inventor 刘健鹏张瑭焦宏达
Owner NANCHANG ANGKUN CO LTD
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