LED package structure with plane lens group
A technology of LED encapsulation and planar lens, which is applied in the direction of electrical components, electric solid devices, circuits, etc., and can solve problems such as inability to adjust light patterns
Active Publication Date: 2016-06-22
FUJIAN FURI ELECTRONICS CO LTD
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Problems solved by technology
However, these encapsulated lenses are all for the purpose of improving light extraction efficiency. The aspheric surface for light concentrating in the middle of the lens unit can enhance the light concentrating effect. This kind of encapsulation structure is often used in lighting, but it has a negative impact on the manufacturing technology of the lens. Relatively high requirements and the disadvantage of not being able to adjust the light pattern
[0003] Plane lenses are also used in the packaging of LEDs. They are often suitable for miniaturized array packaging, because they are simple and convenient, and can greatly improve packaging efficiency. They are often used in the field of high-density display panels. However, there is no Technique discovered to adjust light speckle using existing flat lenses
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[0012] figure 1 It is a cross-sectional view of the LED packaging structure of an embodiment of the present invention. The substrate 2 is a silicon carbide substrate with high thermal conductivity and heat dissipation performance. The heat generated by the LED chip is mainly transmitted to and dissipated by the substrate; the packaged LED chip is formed on the substrate 2. Necessary circuit layer, the design of the circuit layer can be determined according to the chip connection structure that needs to be packaged, since the design of this circuit layer is well known to those skilled in the art, so the description is omitted here; on the silicon carbide heat dissipation substrate 2 An integrated reflective cup 3 is provided, the inner surface of the reflective cup 3 is a lower inclined surface and an upper vertical surface; on the silicon carbide heat dissipation substrate 2, an LED chip 1 is mounted in the reflective cup, and the type of the LED chip can be determined by the u...
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The invention provides an LED package structure with a plane lens group. The LED package structure comprises the plane lens group; the plane lens group includes a center plane lens located at the center, a middle lens which covers the side surface and top surface of the center plane lens, and a peripheral lens which covers the middle lens; the lowest lower surfaces of the center plane lens, the middle lens and the peripheral lens are located on the same plane; the center plane lens, the middle lens and the peripheral lens have horizontal upper surfaces; the center plane lens has the lowest transmittance; the middle lens has the highest transmittance; and the transmittance of the peripheral lens ranges between the transmittance of the center plane lens and the transmittance of the peripheral lens. The LED package structure can make light softer and form a special annular light pattern, and is especially suitable for decoration.
Description
technical field [0001] The invention relates to an LED package structure, in particular to an LED package plane lens group. Background technique [0002] At present, LED packaging is mainly divided into miniaturized SMT mounting and high-power individual LED packaging. During the packaging process, it is usually necessary to configure the lens. The existing LED packaging lens basically has a smooth aspheric surface for light collection in the light exit direction or the light exit surface of the lens is designed as a microlens array for light mixing, and the outside of the lens often has a smooth total reflection surface. However, these encapsulated lenses are all for the purpose of improving light extraction efficiency. The aspheric surface for light concentrating in the middle of the lens unit can enhance the light concentrating effect. This kind of encapsulation structure is often used in lighting, but it has a negative impact on the manufacturing technology of the lens....
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IPC IPC(8): H01L33/58H01L25/075
Inventor 司红康
Owner FUJIAN FURI ELECTRONICS CO LTD