Scanning path planning method for manufacturing three-dimensional body layer by layer and scanning method

Active Publication Date: 2016-06-29
XIAN BRIGHT ADDTIVE TECH CO LTD
View PDF5 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a scanning path planning method for layer-by-layer manufacturing of three-dimensional objects, which solves the problem of poor accuracy of three-dimensional objects caused by discarding parts of inscribed circles at sharp corner vertices with diameters smaller than light source spot diameters in existing planning methods Problem; Another object of the present invention is to provide a scanning method for manufacturing three-dimensional objects layer by layer, which solves the problem that the actual sintered size at the sharp corner of the existing scanning method is smaller than the prototype size, resulting in a certain amount of defects

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Scanning path planning method for manufacturing three-dimensional body layer by layer and scanning method
  • Scanning path planning method for manufacturing three-dimensional body layer by layer and scanning method
  • Scanning path planning method for manufacturing three-dimensional body layer by layer and scanning method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0038] A scanning path planning method for manufacturing three-dimensional objects layer by layer according to the present invention, the specific implementation steps are as follows: figure 2 As shown, a compensation path 5 is added between the jump point 6 of the conventional scanning path and the vertex 2 of the sharp corner of the three-dimensional object section at the sharp corner of the three-dimensional object section with sharp corners, wherein, the compensation path 5 starts at the sharp corner of the three-dimensional object section The jumping point 6 of the conventional scanning path is the starting point, pointing to the direction of the sharp corner apex 2 of the section of the three-dimensional object, and its length is equal to the distance between the jumping point 6 of the conventional scanning path at the sharp corner of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a scanning path planning method for manufacturing a three-dimensional body layer by layer. A compensation path is additionally arranged between a conventional scanning path jump point at the position of a sharp corner of a cross section of the three-dimensional body with a sharp corner and a vertex of the sharp corner of the cross section of the three-dimensional body. The invention further discloses a scanning method for manufacturing the three-dimensional body layer by layer. The scanning method includes the steps that the cross section of the three-dimensional body with the sharp corner is subject to conventional scanning path planning; the cross section of the three-dimensional body with the sharp corner is subject to compensation path planning; and according to a conventional scanning path and the compensation path, the cross section of the three-dimensional body is subject to scanning sintering, and molding machining of the three-dimensional body is completed. According to the scanning path planning method, the sharp corner of the three-dimensional body is scanned, so that the scanning margin is reduced, the size accuracy of the three-dimensional body is improved, the yield of the three-dimensional body is effectively improved accordingly, and the production cost of an enterprise is reduced.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing, and in particular relates to a scanning path planning method for layer-by-layer manufacturing of three-dimensional objects, and the invention also relates to a scanning method for layer-by-layer manufacturing of three-dimensional objects. Background technique [0002] Additive manufacturing technology is based on three-dimensional CAD model data, by increasing the processing method of material layer-by-layer manufacturing. It is based on the computer three-dimensional design model, through the software layered discrete and numerical control forming system, the material is piled up layer by layer with high-energy beams, and finally superimposed and formed to manufacture physical products. [0003] There are many methods of additive manufacturing, which are mainly divided into manufacturing methods based on powder feeding methods and powder spreading methods. The core ideas of the t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B29C67/00B33Y10/00
CPCB33Y10/00B22F10/00B22F10/28Y02P10/25
Inventor 杨东辉薛蕾
Owner XIAN BRIGHT ADDTIVE TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products