Unlock instant, AI-driven research and patent intelligence for your innovation.

a computer system

A computer system and motherboard technology, applied in the field of computer systems, can solve problems such as increased computer noise, leakage, and reduced airflow, and achieve the effect of ensuring heat dissipation efficiency

Inactive Publication Date: 2018-11-30
李驹光 +3
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the gap will also cause the airflow flowing through the air guide cover to leak through the gap, so that the airflow flowing to the predetermined position is reduced, resulting in a decrease in heat dissipation efficiency and effect
If you want to achieve the expected heat dissipation efficiency and effect, you need to increase the fan speed, however, increasing the fan speed not only increases the power consumption of the computer, but also increases the noise when the computer is working

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • a computer system
  • a computer system
  • a computer system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0015] see figure 1 , is a schematic structural view of the wind deflector 100 according to the first embodiment of the present invention. The air guide cover 100 is used for heat dissipation of a computer system (not shown). The air guide cover 100 includes a cover body 10 and two flexible films 20 .

[0016] The cover body 10 is used to guide the cooling air flow of the computer system. Generally, the cover body 10 is bent and an air guide groove 102 is formed inside to guide the heat dissipation air flow. One end of the air guide groove 102 faces a heat sink. The fan (not shown in the figure) is connected, and the other end extends to an electronic component (not shown in the figure) that needs to dissipate heat, such as a CPU. The cover body 10 includes a top panel 11 and two side panels 12 . The two side panels 12 are parallel to each other and are connected...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a computer system with a wind scooper. The wind scooper comprises a scooper body, wherein the scooper body comprises a top plate and two side plates which are independently connected with the top plate; the scooper body covers a main plate; the scooper body covers a main plate, and a certain interval is formed between the edge of one side, which is far away from the top plate, of each side plate and the main plate; the wind scooper comprises two flexible thin films arranged on the side plates, wherein each flexible film comprises a combination part and a shielding part connected with the combination part, the combination part is fixed on each side plate, and the shielding part is extruded out of the edge of one side, which is far away from the top plate, of the side plate and shields the interval between each side plate and the main plate of the scooper body.

Description

technical field [0001] The invention relates to a computer system with a wind deflector. Background technique [0002] With the advancement of science and technology, people's requirements for the comprehensive performance of products are also constantly increasing. For example, computer products are not only required to have faster computing speeds and more energy-saving, but also require them to have better heat dissipation and mute effects. In order to make the heat dissipation of the computer more efficient, a wind guide cover is generally arranged in the computer to guide the flow of heat dissipation gas. [0003] In existing computer products, the electronic components and the air guide cover are generally arranged on a main board. Due to the limitation of the size of the computer, the position of the air guide cover may conflict with other electronic components on the main board during assembly. In order to avoid damage to the electronic components in the computer pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/202
Inventor 不公告发明人
Owner 李驹光