Vapor deposition support plate and vapor deposition device
A carrier plate and evaporation technology, which is applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of OLED substrate deformation, fragmentation or overall fragmentation, affecting production cycle and product yield, etc. To achieve the effect of avoiding product yield
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Embodiment 1
[0062] Such as figure 1 As shown, the embodiment of the present invention provides an evaporation carrier, the evaporation carrier includes a carrier 1 and a viscosity reducing part 2, the viscosity reducing part 2 is arranged on the carrier 1, and the OLED substrate 3 is fixed by a sensitive glue 4 On one side surface of the carrier plate 1 , the viscosity reducing part 2 is used to reduce the viscosity of the sensitive glue 4 after evaporation is completed.
[0063] Such as figure 2 shown, and see figure 1, in the embodiment of the present invention, when it is necessary to vapor-deposit organic materials on the OLED substrate 3, the OLED substrate 3 is first fixed on one side surface of the evaporation carrier provided by the embodiment of the present invention through the sensitive glue 4, and then the The evaporation carrier is transferred into the vacuum evaporation chamber 6 with the OLED substrate 3 facing down. The vacuum evaporation chamber 6 is provided with an e...
Embodiment 2
[0093] An embodiment of the present invention provides an evaporation device, the evaporation device includes an evaporation carrier, wherein the structural schematic diagram of the evaporation carrier is as follows figure 1 shown.
[0094] In the present invention, the viscosity reducing part 2 of the vapor deposition carrier is used to reduce the viscosity of the sensitive adhesive 4 after the vapor deposition is completed, so that the OLED substrate 3 and the vapor deposition carrier are separated, and avoid the separation of the vapor deposition carrier and the OLED substrate 3 by external force. The OLED substrate 3 is deformed, fragmented or completely broken, so as to avoid affecting the production cycle and product yield.
[0095] The serial numbers of the above embodiments of the present invention are for description only, and do not represent the advantages and disadvantages of the embodiments.
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