A new heat dissipation method for integrated high-density GPU

Abstract

The invention discloses a novel integrated high-density GPU heat dissipation method. The specific implementation process is as follows: first, the server system is divided into upper and lower layers of independent heat dissipation spaces through board cards, a GPU graphics card is placed in the upper space, and a switching chip is placed in the lower space. The two independent spaces are dissipated by cooling fans installed at the rear of the server chassis; the GPU graphics cards on the upper layer are partitioned for heat dissipation, and the gaps between the front row GPU graphics cards are connected to the corresponding back row GPU graphics cards through the windshield. void. Compared with the existing technology, this new integrated high-density GPU heat dissipation method solves the heat dissipation of the rear GPU graphics card through a layered architecture and an isolated heat dissipation design, and at the same time ensures the heat dissipation of the switching chip, thereby ensuring the overall The heat dissipation of the server system is optimal; the independent air guide cover can be used to highly integrate the graphics card, and it has a wide range of applications, and can be applied to the heat dissipation design of all electronic products.

Description

technical field [0001] The invention relates to the technical field of heat dissipation for computer servers, in particular to a novel integrated high-density GPU heat dissipation method with strong practicability. Background technique [0002] Nowadays, in order to meet the technical support for maps and games, the Internet computer industry has higher and higher requirements for the graphics processing of the server, and the demand for the graphics card is also higher and higher. However, considering the cost and space requirements, it is hoped that a large graphics card, such as a GPU card or a MIC card, can be highly integrated in a limited chassis space. The power consumption of these graphics cards is mostly above 200w, and the heat dissipation of these components is a problem. Furthermore, due to the limitation of the rack size of the national standard cabinet, the width of the chassis cannot be infinitely widened, and high-end boards can only be placed in two rows a...

AI Technical Summary

Problems solved by technology

In this way, it is necessary to meet the heat dissipation of high-power GPU cards and ensure the heat dissipation of high-power switching chips. This type of server heat dissipation design is bound to be a big heat dissipation challenge.

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