Fixed plastic body
A body and fixed groove technology, which is applied in the direction of electrical solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve the problems that the thickness of solder paste is difficult to maintain constant, cannot be completely sealed, and moisture intrusion, etc. Achieve the effects of reducing product failure, solving heat generation, and good heat dissipation performance
Active Publication Date: 2019-01-04
ZIBO CHENQI ELECTRONICS
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Problems solved by technology
The disadvantage of the half-encapsulation package is that the sealing of the plastic epoxy and the copper substrate is not enough.
Because epoxy and copper are two different materials, in terms of combination, they cannot be completely sealed, and the use environment of the product may be quite harsh. If there is no seal, it is easy to cause moisture intrusion and product failure.
If you work in a high-temperature and high-humidity environment for a long time, it will cause the paralysis of the entire line
In addition, traditional packaging technology generally uses solder paste as the intermediate medium for soldering, but it is difficult to keep the thickness of the solder paste constant, and it is impossible to determine the optimal sintering temperature, and tin beads are produced during the sintering process, which affects product quality
Method used
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[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0034] like Figure 10-12 As shown, the fixed plastic package body according to the present invention includes a first material piece 1, a second material piece 2, a chip 4 and an epoxy resin molding block 5, sandwiched between the first material piece 1 and the second material piece 2 Hold fixed chip 4. It also includes a solder piece 3, the first material piece 1 and the second material piece 2 are welded and fixed together through the welding piece 3; the epoxy resin plastic block 5 can wrap and mold the first material piece 1 on one side; wherein, the second material The chip 2 and the chip 4 are located between the epoxy resin molding block 5 and the first material 1 .
[0035] like Figure 1-3 As shown, grid-shaped bottom grooves 1.2 are set at the chip fixing position of the first tablet 1 . More than two guide grooves 1.1 ...
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A fixed plastic package body belongs to the field of an electronic information product. The fixed plastic package body is characterized by comprising a first material sheet, a second material sheet, a chip and an epoxy resin plastic package block, wherein the chip is clamped and fixed between the first material sheet and the second material sheet, the fixed plastic package body also comprises a welding sheet, the first material sheet and the second material sheet are welded and fixed together by the welding sheet, the epoxy resin plastic package block can be used for wrapping and plastic packaging the first material sheet by a single surface, and the second material sheet and the chip are arranged between the epoxy resin plastic package block and the first material sheet. By the fixed plastic package body, the sealing compactness and the cooling capability of a chip package technique can be improved.
Description
technical field [0001] The invention belongs to the field of electronic information products, and in particular relates to a chip packaging device. Background technique [0002] SMD packaging technology has existed for many years. Conventional SMD packaging technology generally adopts an all-inclusive frame structure. Products using this structure have relatively stable compactness and reliability. However, as the industry tends to increase the power of products Increasing demands have led to the development of products in the direction of single chip and high power, and the accompanying heat dissipation problem is the first technical problem that needs to be solved. Therefore, most of the existing products adopt ultra-thick heat sink and half-encapsulated packaging technology. The disadvantage of the half-encapsulation package is that the sealing of the plastic epoxy and the copper substrate is not enough. Because epoxy and copper are two different materials, in terms of ...
Claims
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IPC IPC(8): H01L23/495
Inventor 盛春芳陈思太
Owner ZIBO CHENQI ELECTRONICS