Array substrate and manufacturing method therefor

Abstract

The invention provides an array substrate and a manufacturing method therefor. The array substrate comprises a first conductive pattern, wherein the first conductive pattern is covered with an insulating layer with a via hole; a second conductive pattern is arranged in a position, corresponding to the position of the via hole, on the first conductive pattern; and the manufacturing method for the array substrate comprises the step of forming the second conductive pattern in the position, corresponding to the position of the via hole, on the first conductive pattern. By adoption of the array substrate and the manufacturing method therefor provided by the invention, the condition of incomplete exposure or photoresist residue at the bottom of the via hole can be reduced or avoided.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to an array substrate and a manufacturing method thereof. Background technique [0002] In the structure of the existing array substrate, a passivation layer and a resin layer are formed on the source-drain metal layer, and the thickness of the resin layer is generally relatively large. In addition, when the thickness of the passivation layer is added, when the resin layer is exposed, it will Incomplete exposure or residual photoresist at the bottom of the via hole in the Resin layer will cause the contact resistance between the signal wire and the pixel electrode to increase or even not conduct, directly leading to the failure of the display device. The existing method is to increase the exposure energy, which will lead to an increase in TactTime (processing time) and a decrease in production capacity. Contents of the invention [0003] In view of this, the presen...

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Problems solved by technology

[0002] In the structure of the existing array substrate, a passivation layer and a resin layer are formed on the source-drain metal layer. The thickness of the resin layer is generally relatively large, and the thickness of the passivation layer is added. Incomplete exposure or residual photoresist at the bottom of the via hole in the Resin layer will cause the contact resistance between the signal wire and the pixel electrode to increase or even not conduct, which will directly lead to the failure of the display device

The existing method is to increase the exposure energy, which will lead to an increase in TactTime (processing time) and a decrease in production capacity

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