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Adhesive tape

A technology of adhesive tape and adhesive layer, applied in the direction of adhesive type, ester copolymer adhesive, polymer adhesive additive, etc., can solve the problem of winding loose, capacitor element capacity reduction, winding deviation and other problems to achieve the effect of preventing winding loosening

Inactive Publication Date: 2016-07-13
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As mentioned above, when the conventional adhesive tape is used for winding and fixing in applications requiring higher heat resistance, there is a problem that the winding of the capacitor element is loosened, winding deviation, etc., and the capacity of the capacitor element is reduced.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] A composition containing 100 parts of a copolymer polymer (base polymer) composed of 90 parts of 2-ethylhexyl acrylate and 10 parts of acrylic acid and 1 part of an isocyanate crosslinking agent was prepared. This composition was coated on a substrate (made of polyphenylene sulfide (PPS), thickness 25 μm) and dried so that the thickness after drying became 20 μm, thereby obtaining an adhesive tape having an adhesive layer on the substrate. The acid value of the base polymer contained in this pressure-sensitive adhesive layer was 73.9. The obtained pressure-sensitive adhesive tape was used for the above-mentioned evaluations (2) to (5). The results are shown in Table 1.

Embodiment 2

[0102]A composition containing 100 parts of a copolymer polymer (base polymer) composed of 93 parts of 2-ethylhexyl acrylate and 7 parts of acrylic acid and 3 parts of an isocyanate crosslinking agent was prepared. This composition was applied on a base material (made of polyimide (PI), thickness 25 μm) and dried so that the thickness after drying became 20 μm, thereby obtaining an adhesive tape having an adhesive layer on the base material. The acid value of the base polymer contained in this pressure-sensitive adhesive layer was 51.7. The obtained pressure-sensitive adhesive tape was used for the above-mentioned evaluations (2) to (5). The results are shown in Table 1.

Embodiment 3

[0104] A composition containing 100 parts of a copolymer polymer (base polymer) composed of 80 parts of 2-ethylhexyl acrylate and 20 parts of acrylic acid and 1 part of an isocyanate crosslinking agent was prepared. This composition was applied on a base material (made of polyimide (PI), thickness 25 μm) and dried so that the thickness after drying became 20 μm, thereby obtaining an adhesive tape having an adhesive layer on the base material. The acid value of the base polymer contained in this pressure-sensitive adhesive layer was 147.8. The obtained pressure-sensitive adhesive tape was used for the above-mentioned evaluations (2) to (5). The results are shown in Table 1.

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Abstract

The invention provides an adhesive tape having advantages of excellent heat-resistant performance and ability of carrying out reeling and fixing of capacitor elements in high temperature condition. The adhesive tape is provided with a base material, which is provided with an adhesive agent layer on at least single surface. The adhesive tape layer comprises base polymer, the acid value of which is in a range from 45mg KOH / g to 150 mg KOH / g. In one embodiment, the above mentioned base polymer is the acrylic acid polymer. In one embodiment, the acrylic acid polymer comprises the structure unit of the (methyl) alkyl acrylate provided with the branch chain-shaped alkyl group.

Description

technical field [0001] This invention relates to adhesive tapes. In more detail, it is related with the adhesive tape which can be used for winding and fixing a capacitor element. Background technique [0002] Usually, a capacitor element is formed by winding an electrolytic paper between an anode foil and a cathode foil and winding it into a cylinder. Conventionally, adhesive tapes have been often used for winding and fixing such capacitor elements (for example, Patent Documents 1 and 2). [0003] In recent years, capacitor elements have been used in processes performed at higher temperatures than conventional ones. For example, in a reflow process, they may be heated at higher temperatures than conventional ones (for example, 260° C. compared to 230° C. conventionally). In addition, long-term storage properties at high temperatures (for example, 150° C.) are also required. [0004] As described above, when the conventional adhesive tape is used for winding and fixing in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/08C09J11/08
CPCC08L2205/025C09J7/25C09J11/08C09J133/08C09J2301/414C09J2433/00C09J2479/086C09J2481/006C08L33/08C08L93/04
Inventor 下川大辅有满幸生
Owner NITTO DENKO CORP