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Aluminum-resin composite and method for producing the same

A technology of composites and resins, applied in chemical instruments and methods, devices for coating liquids on surfaces, coatings, etc.

Inactive Publication Date: 2016-07-13
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, most metallic materials cause electromagnetic interception

Method used

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  • Aluminum-resin composite and method for producing the same
  • Aluminum-resin composite and method for producing the same
  • Aluminum-resin composite and method for producing the same

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no. 1 example

[0058] According to the first embodiment of the present disclosure, the method of manufacturing the aluminum-resin composite body 1 may include aluminum processing.

[0059] Such as Figure 4 As shown, the aluminum treatment according to the first embodiment of the present disclosure may include pickling S1. Foreign matter adhering to the surface of the aluminum 10 can be removed by dipping S1. The aluminum 10 may be immersed in a degreasing tank to remove emulsion or oil attached to the surface of the aluminum 10 .

[0060] In dipping S1, an acid solution may be used. The acid solution can be nitric acid or sulfuric acid. In immersion S1, foreign substances may be removed from the surface of the aluminum 10 using an alkali solution.

[0061] In dipping S1, a surfactant may be added to prevent stains such as fingerprints, and another additive may be added if necessary.

[0062] The aluminum treatment according to the first embodiment may include surface treatment S2. The...

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Abstract

An aluminum-resin composite with an improved structure for increasing a bonding force between aluminum and resin, and a method of producing the aluminum-resin composite are provided. The aluminum-resin composite may include aluminum etched by a chemical etching solution to form an uneven surface having surface roughness of a mean projection-depression interval RSm from 50 [mu]m to 150 [mu]m and a maximum height Rz from 2 [mu]m to 35 [mu]m, and resin penetrating the uneven surface to be bonded with the aluminum.

Description

technical field [0001] Embodiments of the present disclosure relate to an aluminum-resin composite body and a manufacturing method thereof, and more particularly, to an aluminum-resin composite body having an improved structure that increases bonding force between aluminum and resin, and to manufacturing the aluminum-resin composite body. - Method of resin composite. Background technique [0002] Electronics require more innovation in design and function. Specifically, many mobile products use metal materials to achieve delicate designs. However, most metallic materials cause electromagnetic interception. In order to prevent such electromagnetic interception, the use of metal-resin composites has been considered. If a metal-resin composite is used, functional problems such as electromagnetic interception can be overcome while achieving a differentiated design. In metal-resin composites, the bonding force between metal and resin is one of the important factors that determ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/20C23G1/22C23C22/66C23G1/12B32B15/088B32B15/09B32B15/08B32B15/20B29C45/14
CPCB29C45/14B32B15/08B32B15/088B32B15/09B32B15/20C23C22/66C23F1/20C23G1/125C23G1/22C08K3/08C08L77/06C08K2003/0812B05D3/002B05D2202/25B05D3/102C09D181/04C23F1/02B05D2350/35
Inventor 孙相益金亚星金浩渊郑东水
Owner SAMSUNG ELECTRONICS CO LTD
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