Flexible electronics preparing, transferring, and packaging system and method

Abstract

The invention discloses a flexible electronics preparing, transferring, and packaging system and method. The system comprises a substrate transferring module, a flexible electronics preparing module, a laser stripping module, and a packaging, loading and unloading module. The substrate transferring module is used for picking up a substrate and placing the substrate on the flexible electronics preparing module, and transferring prepared flexible electronic device and the substrate to the laser stripping module, and finally reclaims the stripped substrate from the laser stripping module. The flexible electronics preparing module is used for preparing the flexible electronic device on the substrate. The laser stripping module is used for stripping the prepared flexible electronics off the substrate. The packaging, loading and unloading module is used for placing a product to be packaged on a packaging module, packages the flexible electronics stripped from the substrate on the product, and taking down the packaged product. The method prepares, transfers, and packages the flexible electronic device by using the system. The system is greatly decreased in size, reduces intermediate links, saves space, and increases production efficiency.

Description

technical field [0001] The invention belongs to the field of flexible device manufacturing, and more specifically relates to a flexible electronic preparation, transfer and packaging system and method. Background technique [0002] Flexible electronics, also known as printed electronics or organic electronics, is a technology that deposits organic / inorganic electronic devices on flexible substrates to form circuits. Since the performance of flexible electronics is equivalent to that of traditional microelectronics, and it has the characteristics of portability, transparency, light weight, stretch / bend, and easy rapid large-area printing, many new applications have been generated, such as flexible displays, thin-film solar cells, large-area sensors and actuators, etc. The flexible electronics manufacturing process usually includes material preparation, deposition, patterning, and packaging. Flexible electronics manufacturing mainly focuses on factors such as production cost,...

AI Technical Summary

Problems solved by technology

[0003] At present, there are more and more researches on the process and system of flexible electronic device manufacturing, but some of the current manufacturing systems require manual operation, and their automation level is not high; some of them use fully automatic preparation systems, but each module Relatively independent, resulting in a bulky system; in addition, because flexible electronics are very thin and soft, more complicated methods are required for the transfer and storage of flexible electronics

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