Method for manufacturing ceramic part with closed cavity structure for high-frequency high-speed ceramic package shell

Abstract

The invention discloses a method for manufacturing a closed-cavity ceramic part for a high-frequency and high-speed ceramic packaging shell, and relates to the technical field of semiconductor microelectronic device preparation. The method comprises the following steps: preparing a green porcelain tape; using a punching device to punch holes and form a cavity on the cut green porcelain tape at a position where holes need to be punched and forming a cavity; The required metallization pattern is printed by screen printing on the corresponding position of the side wall; the sacrificial material is filled inside the formed cavity; the laminated green ceramic sheet is laminated, and the interlayer density is controlled by adjusting the process parameters and the shape of the cavity; sintering the prepared green porcelain piece, during the sintering process of the green porcelain piece, the sacrificial material is burnt out, and a ceramic piece with a closed cavity structure is prepared. The inside of the closed cavity of the ceramic part prepared by the method has a good shape, and the wiring on the bottom side of the closed cavity can meet the higher frequency signal transmission requirements.

Description

technical field [0001] The invention relates to the technical field of semiconductor microelectronic device preparation, in particular to a method for manufacturing a closed-cavity structural ceramic part for a high-frequency, high-speed ceramic packaging shell. Background technique [0002] The ceramic parts are alumina ceramics, but not limited to alumina ceramics, aluminum nitride ceramics, LTCC and other ceramics. The traditional multi-layer ceramic processing adopts tape casting process to prepare green ceramic strips, which are cut into standard-sized green ceramic sheets, and punching equipment is used to process positioning holes and cavities on the green ceramic sheets, and tungsten paste is used on the surface of the green ceramic sheets material or molybdenum paste, gold, silver, copper and other conductive pastes can also be used, metallized graphics are printed by precision screen printing technology, multi-layer raw ceramic sheets are stacked, laminated, and th...

AI Technical Summary

Problems solved by technology

Relying on the traditional multi-layer ceramic shell processing technology, a narrower wiring width of the internal RF lines of the ceramic is required, and the screen printing process used for the internal lines is due to its own process characteristics - screen mesh, metal paste and printing processing It is difficult to meet the design requirements of ceramic shells with higher frequencies and speeds due to constraints such as manufacturability

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