Wafer Slicing Device and Wafer Loading and Unloading System

Abstract

Embodiments of the invention provide a silicon wafer separation device and a silicon wafer loading and unloading system. The silicon wafer separation device may comprise an upper sucker, a lower sucker, a first slider drive motor, a first slider, a first transmission mechanism, a horizontal slide rail, and a first cylinder. The first cylinder drives the upper sucker to move up and down. The lower sucker is fixedly arranged at the lower side of a first silicon wafer conveyor belt. When the silicon wafer separation device sucks up an upper silicon wafer in a silicon wafer group, the first silicon wafer conveyor belt stops running, the upper sucker inhales and adsorbs the upper silicon wafer, the lower sucker inhales and adsorbs a lower silicon wafer, the upper sucker is driven by the first cylinder to move up, and the silicon wafers in the silicon wafer group are separated. After the silicon wafers in the silicon wafer group are separated, the lower sucker stops inhaling, and the lower silicon wafer in the silicon wafer group continues to be conveyed by the first silicon wafer conveyor belt. According to the invention, the upper and lower suckers can absorb silicon wafers to make the silicon wafers separated. As no friction is generated between the upper and lower silicon wafers when the suckers absorb silicon wafers to make the silicon wafers separated, damage to the silicon wafers is avoided.

Description

Technical field [0001] The invention relates to the technical field of silicon wafer processing equipment, in particular to a silicon wafer slicing device and a silicon wafer loading and unloading system. Background technique [0002] With the increasing depletion of non-renewable energy sources such as oil and coal, new energy sources such as solar and wind energy have obtained new development opportunities. [0003] In the production process of the silicon wafer battery, it is necessary to separate the back-to-back silicon wafer group (ie, the quartz wafer group), and transfer the separated two silicon wafers to two different conveyor belts. The existing silicon wafer separation technology is equipped with a roller on the conveyor belt that conveys the wafer group. The roller can contact the silicon wafer above the wafer group, and the friction generated by the rotation drives the upper silicon wafer to move to another conveyor belt. The silicon wafers are continuously conveyed ...

AI Technical Summary

Problems solved by technology

[0004] However, in the existing silicon wafer separation technology, during the separation process of the silicon wafer, the upper silicon wafer will slide on the lower silicon wafer when the roller drives the upper silicon wafer to move, and a certain amount of friction will be generated between the two.

Since the silicon wafer is relatively thin, it is easy to break due to friction

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