Parameter changeable type laser machining device

Abstract

The invention relates to a parameter changeable type laser machining device, and belongs to the field of laser machining and precise moving platforms. The parameter changeable type laser machining device is composed of a three-dimensional test piece moving system and a two-dimensional blocking piece moving system which is arranged on the three-dimensional test piece moving system. Three piezoelectric stacks of the three-dimensional test piece moving system can drive a test piece to move in three directions, namely, the X-axis direction, the Y-axis direction and the Z-axis direction, the two-dimensional blocking piece moving system is driven by a miniature stepping motor, the X-axis and Y-axis movement of two blocking pieces can be achieved so as to change the position of a laser machining focal point, and the two blocking pieces can be driven by the miniature stepping motor to relatively move so as to change the size of an opening and adjust the size of the laser machining focal point, wherein rapid large-area low-precision machining can be achieved due to the large focal point, and slow partial high-precision machining can be achieved due to the small focal point. The parameter changeable type laser machining device has the advantages that movement precision is high, response frequency is high, the size and position of the laser machining focal point can be adjusted, and three-direction movement decoupling is achieved through a test piece moving system.

Description

technical field [0001] The invention belongs to the field of laser processing technology and precision motion platform, in particular to a laser processing device with variable focus size and position. Background technique [0002] The manufacture of complex optical free-form surfaces is an important research content in the field of precision manufacturing. Parts with optical free-form surfaces are widely used in aerospace, military and other fields. However, the traditional processing technology cannot meet the processing and preparation requirements of the relatively complex optical free-form surface. The depth of the processed surface microstructure is relatively small, and there are problems such as high equipment cost and long preparation cycle. [0003] Laser processing is a clean and efficient technical means. During the processing, the energy released when the laser beam is irradiated on the surface of the workpiece melts and evaporates the workpiece to achieve the p...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a parameter-variable laser processing device to solve the existing problems of low precision, inability to adjust the size and energy of the laser focus, and inability to move the focus position in a large range

Images