Electroplating jig and electroplating process

Abstract

The invention discloses an electroplating jig and an electroplating process. The electroplating jig is used for fixing a shell to electroplate the shell, wherein a conductive layer is arranged on the surface of at least one side of the shell. The electroplating jig comprises a bottom plate and a plurality of slide block assemblies, wherein the plurality of slide block assemblies are slidably connected to the bottom plate respectively; the bottom plate is fixedly connected with the shell; a preset distance is set between the bottom plate and the conductive layer; at least one conductive rod is arranged on each slide block assembly; and the end head of each conductive layer is in conductive contact with the conductive layer. According to the electroplating jig and the electroplating process, which are disclosed by the invention, hardware electroplating for plastic products can be realized; and moreover, current distribution for achieving uniform plating layers is realized in a manner of multi-point contact conduction, thus structural parts with uniform plating layers, low impedance, and high appearance and performance are obtained.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an electroplating jig and an electroplating process. Background technique [0002] With the progress of society, smart electronic products are more and more widely used in life, and people have higher and higher requirements for the quality of life, which also promotes the development of smart electronic products. [0003] The surface of the traditional electronic equipment casing is equipped with a conductive layer, which is electrically connected to the circuit. Usually, the conductive layer is completed by winding copper wires. However, this process is limited by the product structure and cannot produce complex three-dimensional At the same time, coil winding cannot produce fine circuits and special-shaped circuits, which limits the development of smart electronic products to a certain extent. [0004] The three-dimensional conductive film layer can be realized on the complex sh...

AI Technical Summary

Problems solved by technology

[0003] The surface of the traditional electronic equipment casing is equipped with a conductive layer, which is electrically connected to the circuit. Usually, the conductive layer is completed by winding copper wires. However, this process is limited by the product structure and cannot produce complex three-dimensional 3D structure, at the same time, coil winding cannot produce fine circuits and special-shaped circuits, which limits the development of smart electronic products to a certain extent

[0004] The three-dimensional conductive film layer can be realized on the complex shell by using LDS laser direct forming technology, and then the conductive film layer can be thickened through the metal plating process, so as to meet the functional requirements of electronic products; but because the existing metal plating process is mainly suitable for For metal shells, effective jig connections cannot be made for plastic substrate products, and the problem of uneven current distribution cannot be improved, resulting in uneven coating film thickness of electronic products, which seriously affects the performance of electronic products

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