Integrated computer case structure

Abstract

The invention discloses an integrated computer case structure which comprises a case shell and a case inner cavity, wherein a mainboard CPU heat radiation module, a video card GPU heat radiation module and a power supply module are arranged in the case inner cavity, the video card GPU heat radiation module is arranged in the middle of the case inner cavity, the mainboard CPU heat radiation module is arranged in the left side of the case inner cavity, the power supply module is arranged in the right side of the case inner cavity, the mainboard CPU heat radiation module is connected with a mainboard component, and the video card GPU heat radiation module is connected with a video card component. According to the structure, under the condition that the conventional volume is not changed, a fully new concept that relatively reasonable heat radiation modules are used for layered heat radiation is adopted, so that the case structure is compact in structure, good in heat radiation effect, and stable in working. Through the design of layered heat radiation, and specific heat radiation channels, the heat of two main heat generation sources, namely the mainboard CPU and the video card GPU, is led out of the case inner cavity through a heat pipe, and is led out through the specific heat radiation channels, the hardware working environment is greatly improved, the temperature heat in the case inner cavity is greatly reduced, and good heat radiation effect is achieved.

Description

technical field [0001] The invention relates to an all-in-one computer case structure. Background technique [0002] All-in-one computers are relatively common in our lives. The inside of the case includes power supply modules, CPU modules, motherboard modules, graphics card modules, storage devices, cooling fans and other structures. In the manufacture of general all-in-one computer cases, due to the size of the case Therefore, in order to bring a brand-new user experience and make the equipment run stably, most manufacturers choose low-power hardware equipment to reduce the heat generated by the hardware. Ensure stable operation. However, the choice of low-power hardware devices is a helpless move. For example, the low-power version of the CPU with the same specifications will greatly reduce the heat generation, but the computing speed and maximum computing power are greatly reduced, and the price is much higher than the conventional version. . Contents of the inventio...

AI Technical Summary

Problems solved by technology

However, the choice of low-power hardware devices is a helpless move. For example, the low-power version of the CPU with the same specification will greatly reduce the heat generation, but the computing speed and maximum computing power will be greatly reduced, and the price is much higher than the conventional version.

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