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A method for manufacturing a sip module, a method for cutting silver glue grooves, and a system

A cutting method and cutting system technology, applied in the direction of manufacturing tools, welding equipment, laser welding equipment, etc., can solve the problems of product scrapping, flow characteristic pollution, etc.

Active Publication Date: 2017-09-29
HUANWEI ELECTRONICS SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, because the silver glue is liquid before it is cured, its flowing characteristics may contaminate other areas that cannot be contaminated with silver glue, thus causing the product to be scrapped

Method used

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  • A method for manufacturing a sip module, a method for cutting silver glue grooves, and a system
  • A method for manufacturing a sip module, a method for cutting silver glue grooves, and a system
  • A method for manufacturing a sip module, a method for cutting silver glue grooves, and a system

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Embodiment Construction

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0047] In order to make the drawing concise, each drawing only schematically shows the parts related to the present invention, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. Herein, "a" not only means "only one", but also means "more than one".

[0048] In one emb...

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PUM

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Abstract

The invention discloses an SIP module manufacturing method and an elargol groove cutting method and system and relates to the field of semiconductors. The elargol groove cutting method comprises the step that S10, groove cutting data in a curing region of an SIP module are obtained and comprise a groove cutting path and a groove cutting position; S20, cutting is conducted in the curing region through laser according to the groove cutting data, a groove for being filled with elargol is formed, and a preserved curing part exists in the position between the groove and the exposed region of the SIP module; S30, after the elargol charged into the groove is cured, data of the distance between the preserved curing part and the exposed region are obtained; and S40, according to preset laser control parameters corresponding to the distance data, the preserved curing part is cut through laser, and the curing region and the exposed region are broken through. After the elargol is cured, the corresponding preset laser control parameters are automatically obtained, the preserved curing part is cut, and the product scrapped probability is reduced.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a method for manufacturing a SIP module, a method and a system for cutting silver glue grooves. Background technique [0002] With the development and progress of laser cutting technology, laser cutting technology is widely used in the semiconductor industry due to its advantages of high precision, fast speed, small heat-affected zone, not easy to deform products, high cost performance, low cost of use, and stable performance. [0003] In the semiconductor industry, System In a Package (SIP) mainly integrates multiple functional chips into one package to achieve functional integration. Different chip arrangements, combined with different internal bonding technologies, make the SIP packaging form a variety of combinations. [0004] The module refers to the chips, active components and passive components required for welding the module on the upper surface of the PCB to make the PCBA...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38
CPCB23K26/38
Inventor 张亮张少华
Owner HUANWEI ELECTRONICS SHANGHAI CO LTD
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